Product Change Notification
| Change Notification # |
|
16469 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Initial Notification for SOD123 assembly in ON Leshan as 2nd source |
| Issue Date |
|
2010-05-26 |
| Affected Product Family |
|
|
| Description |
|
ON Semiconductor is notifying customers of its plan to qualify SOD-123 assembly in ON Semiconductor’s Leshan facility.
The mold compound, die attach, and lead frame materials used in the SOD-123 package will remain the same. A qualification vehicle has been selected for each of the device functions and full electrical characterization over temperature will be performed on each qualification vehicle to ensure device functionality and electrical specifications are met.
|
| Key Items Affected by Change |
|
ON Semiconductor assembly location |
| |
| Key Milestones |
|
| Effective Date: |
|
2010-09-26 |
| Sample Info: |
|
|
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|