Product Change Notification
| Change Notification # |
|
16088 |
| Revision |
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
NCN6001 expansion into XFAB-Lubbock |
| Issue Date |
|
2008-01-04 |
| Affected Product Family |
|
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| Description |
|
This is a final process change notice to IPCN# 16055. The devices listed below have historically been fabricated at the XFAB facility in Erfurt, Germany, and are now qualified for fabrication at the XFAB facility in Lubbock, TX, USA. All XFAB facilities are certified ISO9001:2000 compliant. XFAB offers the same process technology in both fab locations; no die design or process changes were implemented for this activity. This change is considered a capacity expansion. At the expiration of this FPCN, the devices listed below may be processed at either qualified location.
|
| Key Items Affected by Change |
|
Subcontractor FAB site |
| |
| Key Milestones |
|
| Effective Date: |
|
2008-04-04 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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