Product Change Notification
| Change Notification # |
|
15747 |
| Revision |
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| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of OSPI for Assembly/Test of 8/14/16/20/24/28 Lead SOIC Wide and Narrow Body Packages |
| Issue Date |
|
2007-03-13 |
| Affected Product Family |
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| Description |
|
This is a Final Process Change Notice to IPCN 15621 available at www.onsemi.com notifying customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 8/1416/20/24/28 lead Wide and Narrow body SOIC packages. The devices listed on this FPCN are assembled / tested at the ASE assembly/test facility located in Chung Li, Taiwan. At the expiration of this Final PCN, these devices may be processed at either location.
This is the second Final PCN for this program. Devices will be qualified in phases with only those devices listed below affected by this FPCN.
|
| Key Items Affected by Change |
|
ON SEMICONDUCTOR ASSY and TEST SITE |
| |
| Key Milestones |
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| Effective Date: |
|
2007-05-13 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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