Product Change Notification
| Change Notification # |
|
15685 |
| Revision |
|
|
| Type of Notification |
|
UPDATE NOTIFICATION |
| Change Title |
|
Final Notification - Qualification of the MAX809 MAX810 NCP803 on the ACMOS2 Technology |
| Issue Date |
|
2006-12-12 |
| Affected Product Family |
|
ANALOG |
| Description |
|
This is an update to Final PCN #15611, which announced the qualification of the MAX809 MAX810 NCP803 on the ACMOS2 technology. This Update Notification is being published to include additional affected part numbers that were not originally listed on the FPCN.
This family is currently manufactured on the ACMOS1 technology. Both ACMOS1 and ACMOS2 processes are qualified and in full production at ON Semiconductors MOS7A wafer fab in Aizu, Japan. Assembly and test will continue at the currently-qualified site (ON Semiconductor, Seremban, Malaysia). Device parameters will continue to meet all datasheet specifications and reliability will continue to meet or exceed ON Semiconductor standards. Reliability data is summarized in the FPCN #15611.
Product shipments for all part numbers will continue with the original (ACMOS1) die until expiration of this notification.
Products shipped after expiration of this Update Notification may contain die from either qualified process (ACMOS1 or ACMOS2).
|
| Key Items Affected by Change |
|
Die Shrink |
| |
| Key Milestones |
|
| Effective Date: |
|
2006-02-12 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|