Product Change Notification
| Change Notification # |
|
15667 |
| Revision |
|
|
| Type of Notification |
|
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages |
| Issue Date |
|
2006-10-31 |
| Affected Product Family |
|
ALL |
| Description |
|
This is the Final Process Change Notice to IPCN 15621available at www.onsemi.com to notify customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 16/20/24/28 lead Wide body SOIC packages.
|
| Key Items Affected by Change |
|
Assembly and test site change |
| |
| Key Milestones |
|
| Effective Date: |
|
2006-12-31 |
| Sample Info: |
|
contact local sales office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|