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Product Change Notification

Change Notification #   15621
Revision  
Type of Notification   INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages
Issue Date   2006-07-31
Affected Product Family   ALL
Description   Initial Process Change Notice to notify customers of the capacity expansion of the ON Semiconductor assembly/test location at Carmona, Philippines (OSPI) for 16/20/24/28 lead Wide body SOIC packages.
Key Items Affected by Change   Assembly & Test Site
 
Key Milestones  
Effective Date:   2006-11-30
Sample Info:   na
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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