Product Change Notification
| Change Notification # |
|
12048 |
| Revision |
|
|
| Type of Notification |
|
INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION |
| Change Title |
|
Final Notification for Standard Logic SOIC and TSSOP Additional Wire Size Qualification |
| Issue Date |
|
2002-01-11 |
| Affected Product Family |
|
LOGIC |
| Description |
|
This is the Final Notification for Initial Notification #12048 that went out on 14-Nov-2001.
Au wire qualification at assembly to include reduced diameter 0.8 mil wire in addition to the standard 0.98 mil diameter wire for all SOIC and TSSOP Logic device types. This additional 0.8-mil in diameter will be done in anticipation of fine-pitch devices that will be entering production. All SOIC and TSSOP Logic device types, which are currently using the 0.98-mil Au wire, will be affected by this change which will be implemented in several phases.
|
| Key Items Affected by Change |
|
Assembly Process |
| |
| Key Milestones |
|
| Effective Date: |
|
2002-03-22 |
| Sample Info: |
|
Yes |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|