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Product Change Notification

Change Notification #   11507
Revision  
Type of Notification   INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   Final Notification for Assembly/Test Site Capacity Addition for Broadband Products in the SOIC-8 Package
Issue Date   2001-08-27
Affected Product Family   BROADBAND
Description   ON Semiconductor is pleased to announce that it has successfully completed qualification of the ON Semiconductor Philippines Incorporated (OSPI) facility located in Carmona, Philippines to assemble and test selected Broadband products in SOIC-8 packages. Currently, Broadband SOIC-8 packages are assembled and tested at Advanced Semiconductor Engineering (ASE-CL) in ChungLi, Taiwan.
Key Items Affected by Change   Assembly/Test Site
 
Key Milestones  
Effective Date:   2001-10-27
Sample Info:   Yes
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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