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Product Change Notification

Change Notification #   10341
Revision  
Type of Notification   PRODUCT BULLETIN
Change Title   SMB CU-Clip Conversion
Issue Date   2000-11-03
Affected Product Family   DISCRETES
Description   For the following list of devices, in the SMB package, the clip forming the electrical connection between the top surface of the die and the leadframe will change from nickel-plated copper to bare copper only. This is a continuous improvement change that will enhance solder wetting to the clip. This change only affects an internal package component and has no effect on external package features. This change follows PB#10192, which qualified bare copper clip usage in the SMC package. Reliability testing has been completed and reports are available upon request. This change will be fully instituted by WW46 of 2000.
Key Items Affected by Change  
 
Key Milestones  
Effective Date:   2000-11-12
Sample Info:   None
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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