Product Change Notification
| Change Notification # |
|
10341 |
| Revision |
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| Type of Notification |
|
PRODUCT BULLETIN |
| Change Title |
|
SMB CU-Clip Conversion |
| Issue Date |
|
2000-11-03 |
| Affected Product Family |
|
DISCRETES |
| Description |
|
For the following list of devices, in the SMB package, the clip forming the electrical connection between the top surface of the die and the leadframe will change from nickel-plated copper to bare copper only. This is a continuous improvement change that will enhance solder wetting to the clip. This change only affects an internal package component and has no effect on external package features. This change follows PB#10192, which qualified bare copper clip usage in the SMC package. Reliability testing has been completed and reports are available upon request. This change will be fully instituted by WW46 of 2000.
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| Key Items Affected by Change |
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| Key Milestones |
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| Effective Date: |
|
2000-11-12 |
| Sample Info: |
|
None |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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