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Product Change Notification

Change Notification #   10318
Revision  
Type of Notification   PRODUCT BULLETIN
Change Title   SC74 Package Standardization and Leadframe Change
Issue Date   2000-10-04
Affected Product Family   DISCRETES
Description   This change involves package dimension standardization and the elimination of the internal Silver-stripe from the lead frame in all devices in SC74 package assembled in Seremban, Malaysia.
Key Items Affected by Change   Leadframe
 
Key Milestones  
Effective Date:   2000-10-05
Sample Info:   None
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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