Product Change Notification
| Change Notification # |
|
10318 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT BULLETIN |
| Change Title |
|
SC74 Package Standardization and Leadframe Change |
| Issue Date |
|
2000-10-04 |
| Affected Product Family |
|
DISCRETES |
| Description |
|
This change involves package dimension standardization and the elimination of the internal Silver-stripe from the lead frame in all devices in SC74 package assembled in Seremban, Malaysia.
|
| Key Items Affected by Change |
|
Leadframe |
| |
| Key Milestones |
|
| Effective Date: |
|
2000-10-05 |
| Sample Info: |
|
None |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
|
|