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Product Change Notification

Change Notification #   10192
Revision  
Type of Notification   PRODUCT BULLETIN
Change Title   SMC Bare Copper Clip Conversion
Issue Date   2000-06-29
Affected Product Family   DISCRETES
Description   On all the SMC packages, the clip forming the electrical connection between the top surface of the die and leadframe will change from nickel plated copper to bare copper only. This is a continuous improvement change that will enhance solder wetting to the clip.
Key Items Affected by Change  
 
Key Milestones  
Effective Date:   2000-06-30
Sample Info:   Contact your local ON Semiconductor Sales Office
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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