Product Change Notification
| Change Notification # |
|
10192 |
| Revision |
|
|
| Type of Notification |
|
PRODUCT BULLETIN |
| Change Title |
|
SMC Bare Copper Clip Conversion |
| Issue Date |
|
2000-06-29 |
| Affected Product Family |
|
DISCRETES |
| Description |
|
On all the SMC packages, the clip forming the electrical connection between the top surface of the die and leadframe will change from nickel plated copper to bare copper only. This is a continuous improvement change that will enhance solder wetting to the clip.
|
| Key Items Affected by Change |
|
|
| |
| Key Milestones |
|
| Effective Date: |
|
2000-06-30 |
| Sample Info: |
|
Contact your local ON Semiconductor Sales Office |
| Possible Replacements |
|
N/A |
For more information on this Process Change Notification, please
contact your local ON Semiconductor sales office.
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