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Product Change Notification

Change Notification #   10148
Revision  
Type of Notification   PRODUCT/PROCESS CHANGE NOTIFICATION
Change Title   HYSOL Molding Compound and AFW(American Fine Wire) Change
Issue Date   2000-03-17
Affected Product Family   DISCRETES AND LOGIC
Description   SMP, an ON Semiconductor's QS9002 qualified joint-venture in Malaysia, wants to qualify second source suppliers for mold compound and bonding wire to ensure the smooth flow of production/delivery. ON Semiconductor does not anticipate any impact on quality or delivery to customers. This change may potentially apply to all of the devices in the following packages: SOT23, SC59, SC74, SC70, SC88, SC75.
Key Items Affected by Change   Assembly Process
 
Key Milestones  
Effective Date:   2000-06-25
Sample Info:   Contact your local ON Semiconductor Sales Office.
Possible Replacements   N/A

For more information on this Process Change Notification, please contact your local ON Semiconductor sales office.

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