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PCN Search Results

Part Number = MC14046B

PCN #

Title

Issued

Type

Action

PD20836A 1Q2015 Product Discontinuance Notice 2015-04-17 PRODUCT DISCONTINUANCE View PDF
20029 1Q2013 Product Discontinuance Notice 2013-04-18 PRODUCT DISCONTINUANCE View PDF
16538 Special Leaded Product Discontinuance Notice 2010-11-23 PRODUCT DISCONTINUANCE View PDF
16189 Final Notification for Transfer of Standard Logic Metal Gate Integrated Circuits Die Manufacturing From ON Semiconductor Piestany (Slovakia) To ON Semiconductor Roznov (Czeck Republic). 2009-01-13 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16177 Initial Notification for Transfer of Standard Logic Metal Gate Integrated Circuits Die Manufacturing From ON Semiconductor Piestany (Slovakia) To ON Semiconductor Roznov (Czeck Republic). 2008-12-02 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15667 Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-10-31 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15621 Initial Notification of Qualification of OSPI for Assembly/Test of 16/20/24/28 Lead SOIC Wide Body Packages 2006-07-31 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15511 FINAL NOTIFICATION FOR SOEIAJ 14/16/20L ASSEMBLY SITE TRANSFER TO MITSUI, JAPAN 2006-04-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15333 Update Notification - PB14235 Marking Type Change from Ink to Laser - ASECL 2006-02-01 UPDATE NOTIFICATION View PDF
15157 Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan 2005-12-07 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
14235 Marking Type Change from Ink to Laser at ASECL 2005-07-29 PRODUCT BULLETIN View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
10129 SEI-1 WAFER FAB QUAL FOR METAL GATE CMOS 2000-02-01 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10111 Traceability Code Correction for PB 10100 2000-01-10 PRODUCT BULLETIN View PDF
10100 Date Code Format Change for MFP(SO EIAJ T2) 1999-12-19 PRODUCT BULLETIN View PDF
10101 End of Life of Sticky Tape and Reel for MFP(SO EIAJ T2) Products (L1/L2/R1/R2) 1999-12-19 PRODUCT DISCONTINUANCE View PDF
10104 Emboss Tape and Reel Material Change for MFP(SO EIAJ T2)/TSSOP Products 1999-12-19 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4639 Qualification of ST Microelectronics Metal Gate CMOS for Buy/Resell 1999-04-22 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
4419 MFP14/16/20,LQFP32(7X7) Assembly and Test Site Transfer to Motorola Taiwan 1999-02-07 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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