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PCN Search Results

Part Number = MC100EL1648

PCN #

Title

Issued

Type

Action

20948X Lead finish and BOM change for for DFN/QFN 2x2 and 3x3 Products assembled at Seremban, Malaysia 2015-07-10 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16538 Special Leaded Product Discontinuance Notice 2010-11-23 PRODUCT DISCONTINUANCE View PDF
16529 3Q10 (3rdQUARTER 2010) Product Discontinuance Notice 2010-10-05 PRODUCT DISCONTINUANCE View PDF
16161 Final Notification for M35 and M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-10-21 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16140 H1 2008 (First Half 2008) Leaded Parts to Lead Free Parts standard conversion EOL 2008-08-20 PRODUCT DISCONTINUANCE View PDF
16115 Initial Notification for MOSAIC M35 and MOSAIC M5 products from COM1 wafer fab (Phoenix AZ) to CZ4 wafer fab (Roznov, Czech Republic) 2008-05-23 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16063 Addition of ON Semiconductor Seremban Assembly/Test Site for High Frequency, 8 Lead TSSOP Package 2007-10-30 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
16014 Transfer of High Frequency, 8 Lead TSSOP Package to ON Semiconductor Seremban Assembly/Test Site 2007-05-25 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15511 FINAL NOTIFICATION FOR SOEIAJ 14/16/20L ASSEMBLY SITE TRANSFER TO MITSUI, JAPAN 2006-04-17 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
15157 Initial Notification � SOEIAJ 14/16/20L Assembly Site Transfer to Mitsui, Japan 2005-12-07 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13846 Seremban Assembly/Test Site Addition for HF & Signal Products in 8 Lead TSSOP Package 2004-12-09 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
13248 Lead Free Products Marking Identification 2003-12-05 PRODUCT BULLETIN View PDF
13120 Wafer Fabrication Site Transfer of the 100EL1648, 10EL11 and 10EL31 Product Families to the COM1 Facility 2003-09-16 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12874 Initial Notification for MOSAIC3 Product Transfer to COM 1 2003-04-25 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
12533 Sumitomo Mold Compound Change on TSSOP and Zener Array Packages 2002-08-30 PRODUCT BULLETIN View PDF
12049 Update to IPCN#11369, Wafer Capacity Addition for MOSAIC3 Technology 2001-11-19 UPDATE NOTIFICATION View PDF
11507 Final Notification for Assembly/Test Site Capacity Addition for Broadband Products in the SOIC-8 Package 2001-08-27 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
11369 Initial Notification for Wafer Capacity Addition for MOSAIC3 Technology 2001-04-18 INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
10152 Update Notification for PCN10130 2000-03-15 UPDATE NOTIFICATION View PDF
10130 Three Layer Pre-Plated L/Frames 8/14/16 SOIC Qual 2000-02-02 PRODUCT/PROCESS CHANGE NOTIFICATION View PDF
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