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安森美半导体发布2019年第2季度业绩  Japanese

  • 总收入1,347.7百万美元
  • 公认会计原则 (GAAP)毛利率为37.0%,非公认会计原则(Non-GAAP)毛利率为37.1%
  • GAAP营运毛利率为11.7%, Non-GAAP营运毛利率为15.7%
  • GAAP每股摊薄盈利为$0.24美元,Non-GAAP每股摊薄盈利为$0.42美元
  • 完成对Quantenna Communications的收购,签署对格芯(GLOBALFOUNDRIES)位于纽约州东菲什基尔(East Fishkill, NY)的300mm晶圆厂收购的协议

2019年8月5日 - 安森美半导体公司 (ON Semiconductor Corporation,美国纳斯达克上市代号:ON) 于美国时间8月4日宣布,2019年第2季度收入为1,347.7百万美元,较2018年第2季度收入下降约7%。2019年第2季度收入较2019年第1季度收入下降约3%。

在第二季度,安森美半导体宣布已签定分阶段交易协议收购格芯位于纽约州东菲什基尔的300mm晶圆厂及相关资产。安森美半导体还宣布完成对高性能Wi-Fi半导体领袖Quantenna Communications的收购。

安森美半导体总裁兼首席执行官傑克信 (Keith Jackson) 说:“商业环境持续疲软,我们预期短期内会出现亚季节(sub-seasonal)需求趋势,因为地缘政治因素可能继续对需求造成压力。虽然近期需求疲软,但推动我们业务的关键长期因素维持不变,在需求疲软和能见度有限的环境下,我们继续重视执行,以减轻当前需求疲软的影响。我们仍然对专注于汽车、工业和云电源终端市场的长期大趋势的战略有信心,审慎投资,以进一步加强我们在这些市场的地位。”

第2季度业绩(GAAP)
(百万美元,
每股数据除外)
2019年第2季度
2018年第2季度
同比变动
2019年第1季度
环比变动
收入
$1,347.7
$1,455.9
(7)%
$1,386.6
(3)%
毛利
$499.0
$555.0
(10)%
$513.7
(3)%
营运收入
$158.3
$197.2
(20)%
$179.4
(12)%
安森美半导体公司
应占收入净额
$101.8
$155.3
(34)%
$114.1
(11)%
每股摊薄盈利
$0.24
$0.35
(31)%
$0.27
(11)%
摊薄股数(百万)
417.1
444.3
(6)%
417.7
- %

 

第2季度业绩(Non-GAAP)
(百万美元)
2019年第2季度
2018年第2季度
同比变动
2019年第1季度
环比变动
收入
$1,347.7
$1,455.9
(7)%
$1,386.6
(3)%
毛利
$499.6
$555.2
(10)%
$513.7
(3)%
营运收入
$211.4
$237.6
(11)%
$215.2
(2)%
安森美半导体公司
应占收入净额
$175.0
$199.7
(12)%
$177.1
(1)%
每股摊薄盈利
$0.42
$0.46
(9)%
$0.43
(2)%
摊薄股数
413.8
431.6
(4)%
413.8
- %

 

第4季度主要现金流项目
(百万美元)
2019年第2季度
2018年第2季度
同比变动
2019年第1季度
环比变动
现金税
$12.9
$13.3
(3)%
$15.2
(15)%
营运现金流
$222.4
$268.5
(17)%
$138.4
61%
自由现金流
$68.9
$115.6
(40)%
($18.6)
N/A

2019年第3季度展望

按现时产品订单趋势、未完成订单水平和估计周转水平,本公司预计2019年第3季度的收入将约为1,355百万美元至1,405百万美元。预期2019年第3季度的GAAP毛利率将在35.2%至36.2%之间。预期2019年第3季度的Non-GAAP毛利率将在36.7%至37.7%之间。2019年第3季度展望还包括以股票支付报酬的预期支出约21百万美元至23百万美元。预期缴付所得税的净现金为11百万美元至15百万美元。下表概列安森美半导体2019年第3季度的GAAP及non-GAAP展望。

 
安森美半导体GAAP总额
特别项目**
安森美半导体non-GAAP总额***
收入
$1,355 百万美元至
$1,405 百万美元
-
$1,355 百万美元至
$1,405 百万美元
毛利率
35.2% 至 36.2%
36.7% 至 37.7%
营运支出
$349 百万美元至
$369 百万美元
$34 百万美元至
$38 百万美元
$315 百万美元至
$331 百万美元
其他收入及支出净额(包括利息支出)
$38 百万美元至
$41 百万美元
$9 百万美元至
$10 百万美元
$29 百万美元至
$31 百万美元
摊薄股数*
420 百万
6 百万
414 百万

FINANCIALS

* Convertible Notes, Non-cash Interest Expense is calculated pursuant to FASB's Accounting Standards Codification Topic 470: Debt.

** Diluted share count can vary as a result of, among other things, the actual exercise of options or vesting of restricted stock units, the incremental dilutive shares from the Company's convertible senior subordinated notes, and the repurchase or the issuance of stock or convertible notes or the sale of treasury shares. In periods in which the quarterly average stock price per share exceeds $18.50, the non-GAAP diluted share count and non-GAAP net income per share include the impact of the Company’s hedge transactions issued concurrently with our 1.00% convertible notes. As such, at an average stock price per share between $18.50 and $25.96, the hedging activity offsets the potentially dilutive effect of the 1.00% convertible notes. In periods when the quarterly average stock price per share exceeds $20.72, the non-GAAP diluted share count and non-GAAP net income per share include the anti-dilutive impact of the Company’s hedge transactions issued concurrently with the 1.625% convertible notes. At an average stock price per share between $20.72 and $30.70, the hedging activity offsets the potentially dilutive effect of the 1.625% convertible notes. Both GAAP and non-GAAP diluted share counts are based on the Company’s stock price as of June 28, 2019.

*** Special items may include: amortization of acquisition-related intangibles; expensing of appraised inventory fair market value step-up; purchased in-process research and development expenses; restructuring, asset impairments and other, net; goodwill impairment charges; gains and losses on debt prepayment; non-cash interest expense; actuarial (gains) losses on pension plans and other pension benefits; and certain other special items, as necessary. These special items are out of our control and could change significantly from period to period. As a result, we are not able to reasonably estimate and separately present the individual impact or probable significance of these special items, and we are similarly unable to provide a reconciliation of the non-GAAP measures. The reconciliation that is unavailable would include a forward-looking income statement, balance sheet and statement of cash flows in accordance with GAAP. For this reason, we use a projected range of the aggregate amount of special items in order to calculate our projected non-GAAP operating expense outlook.

**** We believe these non-GAAP measures provide important supplemental information to investors. We use these measures, together with GAAP measures, for internal managerial purposes and as a means to evaluate period-to-period comparisons. However, we do not, and you should not, rely on non-GAAP financial measures alone as measures of our performance. We believe that non-GAAP financial measures reflect an additional way of viewing aspects of our operations that, when taken together with GAAP results and the reconciliations to corresponding GAAP financial measures that we also provide in our releases, provide a more complete understanding of factors and trends affecting our business. Because non-GAAP financial measures are not standardized, it may not be possible to compare these financial measures with other companies' non-GAAP financial measures, even if they have similar names.

电话会议

安森美半导体将于美国东部夏令时间(EDT) 2019年8月5日上午9时为金融界举行电话会议,讨论安森美半导体第2季度业绩的发布。英语电话会议将在公司网站http://www.onsemi.cn的“投资者关系”网页作实时广播。实时网上广播大约1小时后在该网站回放,为时30天。投资者及有兴趣者如想参加业绩报告英语电话会议,请拨877-356-3762 (美国/加拿大),或1-262-558-6155(国际),并提供该会议的ID号码 —9773767。

关于安森美半导体
安森美半导体(ON Semiconductor,美国纳斯达克上市代号:ON)致力于推动高能效电子的创新,使客户能够减少全球的能源使用。安森美半导体领先于供应基于半导体的方案,提供全面的高能效电源管理、模拟、传感器、逻辑、时序、互通互联、分立、系统单芯片(SoC)及定制器件阵容。公司的产品帮助工程师解决他们在汽车、通信、计算机、消费电子、工业、医疗、航空及国防应用的独特设计挑战。公司运营敏锐、可靠、世界一流的供应链及品质项目,一套强有力的守法和道德规范计划,及在北美、欧洲和亚太地区之关键市场运营包括制造厂、销售办事处及设计中心在内的业务网络。更多信息请访问http://www.onsemi.cn

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安森美半导体和安森美半导体图标是 Semiconductor Components Industries, LLC的注册商标。所有本文中出现的其它品牌和产品名称分别为其相应持有人的注册商标或商标。虽然公司在本新闻稿提及其网站,但此稿并不包含其网站中有关的信息。

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11.6 Records; Audit. Licensee agrees that it shall maintain accurate and complete records relating to its activities under Section 2.1(b)(iii) of this Agreement during the term of this Agreement. Upon reasonable advance written notice, ON Semiconductor shall have the right no more frequently than once in any 12 month period during the term of the Agreement, through an independent third party approved by Licensee in writing (such approval not to be unreasonably withheld), to examine and audit such records and Licensee's compliance with the terms of Section 2.1(b)(iii) of this Agreement. Any such audit shall not interfere with the ordinary business operations of Licensee and shall be conducted at the expense of ON Semiconductor. All reports, documents, materials and other information collected or prepared during an audit shall be deemed to be the confidential information of Licensee ("Licensee Confidential Information"), and ON Semiconductor shall protect the confidentiality of all Licensee Confidential Information; provided that, such Licensee Confidential Information shall not be disclosed to any third parties with the sole exception of the independent third party auditor approved by Licensee in writing, and its permitted use shall be restricted to the purposes of the audit rights described in this Section 11.6.

11.7 No Joint Venture, Agency, etc. Nothing in this Agreement shall be construed as creating a joint venture, agency, partnership, trust or other similar association of any kind between the parties hereto. The parties hereto are for all purposes of this Agreement independent contractors, and neither shall hold itself out as having any authority to act as an agent or partner of the other party, or in any way bind or commit the other party to any obligations.

11.8 Interpretation. In this Agreement, words importing a singular number only shall include the plural and vice versa, and section numbers and headings are for convenience of reference only and shall not affect the construction or interpretation hereof.

11.9 Entire Agreement; Amendment; Counterparts; Facsimile Copies. This Agreement, including the Exhibits attached hereto, constitutes the entire agreement and understanding between the parties hereto regarding the subject matter hereof and supersedes all other agreements, understandings, promises, representations or discussions, written or oral, between the parties regarding the subject matter hereof. This Agreement may not be amended except in writing signed by an authorized representative of each of the parties hereto. This Agreement may be executed in counterparts, each of which shall be deemed to be an original, and which together shall constitute one and the same agreement. Each party hereto may deliver an executed copy of this Agreement to the other party via facsimile or other electronic means, and such executed copy(ies) sent/received via facsimile or other electronic means shall be deemed an original and binding copy.

12. Confidentiality. Notwithstanding any terms to the contrary in any non-disclosure agreements between the Parties, Licensee shall treat this Agreement and the Content as ON Semiconductor's "Confidential Information" including: not using the Confidential Information except as expressly set forth herein or otherwise authorized in writing; implementing reasonable procedures to prohibit the disclosure, unauthorized duplication, misuse or removal of the Confidential Information; and not disclosing the Confidential Information to any third party except as may be necessary and required in connection with the rights and obligations under this Agreement and subject to confidentiality obligations at least as protective as those set forth herein, or as otherwise required by law. It is expressly understood that all Confidential Information transferred hereunder, and all copies, modifications, and derivatives thereof, will remain the property of ON Semiconductor, and the Licensee is authorized to use those materials only in accordance with the terms and conditions of this Agreement. Upon termination of this Agreement or upon written request, License shall either return all Confidential Information to ON Semiconductor along with all copies and/or derivatives made, including that on computer databases and copies of portions of the Confidential Information, or destroy all such Confidential Information and certify by written memorandum that all such Confidential Information has been destroyed.

Nothing contained in this Agreement limits a party from filing a truthful complaint, or the party's ability to communicate directly to, or otherwise participate in either: (i) any investigation or proceeding with a United States government agency alleging a securities law violation, waste, fraud, or abuse; or (ii) an investigation or proceeding that is protected under a whistleblower provision of a U.S. federal law or regulation.

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