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安森美半导体推出全系列双倍数据速率(DDR)终端稳压器  Japanese Korean

最新高性能集成方案提供有效的源极/汲极限流和 远程感测功能,用于智能手机、消费电子、电脑和汽车应用















New Portfolio of DDR Termination Regulators

2015 年 5 月 28 日 – 推动高能效创新的安森美半导体(ON Semiconductor,美国纳斯达克上市代号: ON),推出一系列新的高性能器件进一步加强了低压降(LDO)线性稳压器产品阵容,以支持双倍数据速率(DDR)内存。NCP51200NCP51400NCP51510NCP51199采用内置功率MOSFET,针对在电脑、数据网络、工业和手持消费市场等广泛应用中的特定应用如SDRAM DIMM内存、伺服器、路由器、智能手机、平板电脑平台、机顶盒、智能电视、打印机和个人电脑/笔记本电脑主机板。还提供经AEC-Q100认证的版本用于汽车应用如嵌入式GPS定位系统、信息娱乐和无线网络及蓝牙通信。

这些高性能LDO支持DDR1、DDR2、DDR3、LPDDR3、DDR4和LPDDR4 标准,终端电压(VTT)低至500毫伏(mV)。当与DDR4和LPDDR4使用时,每一种的主动源电流和汲电流能力达2安培(A)。此外,当使用DDR4 和LPDDR4时,NCP51145可支持高达1.2 A。NCP/NCV51199可为DDR2和DDR3分别提供2 A和1.5 A源汲电流,而NCP51200和NCP51510指定运行于3 A峰值电流并支持远程感测。这些高度集成的DDR终端LDO的优势还包括软启动、片上热关断和(对一些器件) 欠压锁定机制。每一款器件都有高速差分放大器,对线性电压和负载电流瞬变提供超快响应。所有这些器件还都兼容DDR1 和DDR2 ,易于升级到更新的DDR内存。工作温度范围指定为-40 °C 至 +125 °C,可扩展至+150 °C用于汽车版本。

安森美半导体集成电路产品副总裁Simon Keeton说:“DDR内存广泛扩展至许多非传统产品如连接和物联网(IoT)促使增强的数据通信。我们现为整个DDR市场提供全面的变革器件,适用于新设计项目,以及直接替代现有器件;但具更高性能以支持将来内存升级。NCP51400和NCP51510是很先进的集成电路(IC),能支持下一代DDR技术,而NCP51145结合卓越的性能及有吸引力的价格。此外,我们提供通过汽车认证(AEC-Q100)的版本,使最新的信息娱乐和安全系统能跟上新车客户期望的数据要求。

封装和定价

扩展了的15个NCP51xxx LDO 方案提供3 种不同的封装,包括8只引脚的SOIC-EP、8只引脚2x2 mm的DFN和10只引脚3x3 mm的DFN封装。每3,000片批量的单价范围从0.07美元至0.195美元。



About ON Semiconductor
ON Semiconductor (Nasdaq: ON) is driving energy efficient electronics innovations that help make the world greener, safer, inclusive and connected. The company has transformed into our customers’ supplier of choice for power, analog, sensor and connectivity solutions. Our superior products help engineers solve their most unique design challenges in automotive, industrial, cloud power, and Internet of Things (IoT) applications.

ON Semiconductor operates a responsive, reliable supply chain and quality programs, and robust ESG programs. Headquartered in Phoenix, Arizona, the company has a global network of manufacturing facilities, sales and marketing offices and engineering centers in its key markets.

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ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the company references its Web site in this news release, such information on the Web site is not to be incorporated herein.

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