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富士通半导体与安森美半导体宣布战略合作  Japanese Korean

两家公司已经达成: i)晶圆代工服务协议,富士通将为安森美半导体制造晶圆; ii) 安森美半导体将成为富士通日本福岛县会津若松市8英寸晶圆厂少数股东的最终协议

2014年7月31日 – 富士通半导体株式会社(Fujitsu Semiconductor Limted)与安森美半导体(ON Semiconductor,美国纳斯达克上市代号:ONNN)今天(7月31日)宣布,双方已经达成晶圆代工服务协议。根据此协议的条款,富士通将在其日本福岛县会津若松市的8英寸(200 mm)前工序半导体晶圆制造厂为安森美半导体制造晶圆。晶圆初始生产预计将在从今天起的一年之内开始,安森美半导体未来将有机会从这会津若松市晶圆厂获得更多的产能。

为了建立更强的合作关系,两家公司还签署最终协议;根据此协议,安森美半导体将获得富士通半导体新建的分公司(其中将包括富士通的8英寸会津若松晶圆厂)10%的所有权。安森美半导体将为此少数权益支付代价7亿日圆(约700万美元)。此交易预计将在2014年第4季度或2015年初完成,是项交易仍有待特定监管机构批准及按其它成交条件。

富士通半导体代表取締役社長冈田晴基说:“我们相信新公司的增长将有助于区域发展及维持就业。我们预计此晶圆代工服务协议及安森美半导体收购8英寸晶圆厂少数股份协议将大幅促进两家公司的业务。”

安森美半导体总裁兼首席执行官(CEO)傑克信(Keith Jackson)说:“这项战略协议,使安森美半导体获得额外的制造产能,以配合未来几年内我们的生产需求及收入增长。我们相信这些与富士通半导体达成的协议,将使我们能维持领先业界的制造成本结构,及帮助优化我们未来几年内的资本开支。”

关于富士通半导体株式会社
富士通半导体株式会社设计及制造半导体产品,提供高度可靠、优化的方案及支援,以符合客户的不同需求。公司的产品及服务包括定制SoC(ASIC)、代工服务、专用标准产品(ASSP)及铁电随机存取存储器(FRAM),拥有移动、图像、汽车及高性能等应用领域的广泛专知和技术。富士通半导体还推动高能效及环境倡议。富士通半导体总部位于日本横滨市,建于2008年3月21日为富士通株式会社 (Fujitsu Limited)的分公司。全球销售和开发网络分布日本及亚洲各地、欧洲和北美,为全球市场提供半导体方案。更多信息请访问: https://jp.fujitsu.com/group/fsl/en/

请关注官方微博@安森美半导体

关于安森美半导体
安森美半导体(ON Semiconductor,美国纳斯达克上市代号:ON)致力于推动高能效电子的创新,使客户能够减少全球的能源使用。安森美半导体领先于供应基于半导体的方案,提供全面的高能效电源管理、模拟、传感器逻辑、时序、互通互联、分立、系统级芯片(SoC)及定制器件阵容。公司的产品帮助工程师解决他们在汽车、通信、计算机、消费电子、工业、医疗、航空及国防应用的独特设计挑战。公司运营敏锐、可靠、世界一流的供应链及品质项目,一套强有力的守法和道德规范计划,及在北美、欧洲和亚太地区之关键市场运营包括制造厂、销售办事处及设计中心在内的业务网络。更多信息请访问https://www.onsemi.cn

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安森美半导体和安森美半导体图标是 Semiconductor Components Industries, LLC的注册商标。所有本文中出现的其它品牌和产品名称分别为其相应持有人的注册商标或商标。虽然公司在本新闻稿提及其网站,但此稿并不包含其网站中有关的信息。

This document contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements include, but are not limited to, statements related to the consummation and benefits of the strategic partnership between ON Semiconductor (“ON”) and Fujitsu Semiconductor Limited (“FSL”) and the future financial performance of ON. These forward-looking statements are based on information available to ON and Fujitsu as of the date of this release and current expectations, forecasts and assumptions and involve a number of risks and uncertainties that could cause actual results to differ materially from those anticipated by these forward-looking statements. Such risks and uncertainties include a variety of factors, some of which are beyond our control. In particular, such risks and uncertainties include, but are not limited to, the risk that one or more closing conditions to the transaction may not be satisfied or waived, on a timely basis or otherwise; the risk that the transaction does not close when anticipated, or at all, including the risk that the requisite regulatory approvals may not be obtained; the transaction may involve unexpected costs, liabilities or delays; difficulties leveraging manufacturing capacity; the possibility that expected benefits and cost savings may not materialize as expected; the variable demand and the aggressive pricing environment for semiconductor products; revenues and operating performance; changes in overall economic conditions and markets, including the current credit markets; the cyclical nature of the semiconductor industry; changes in demand for our products; changes in inventories at customers and distributors; technological and product development risks; availability of raw materials; competitors’ actions; pricing and gross margin pressures; loss of key customers; order cancellations or reduced bookings; changes in manufacturing yields; control of costs and expenses; significant litigation; risks associated with international operations including foreign employment and labor matters associated with unions and collective bargaining agreements; the threat or occurrence of international armed conflict and terrorist activities both in the United States and internationally; risks related to new legal requirements; risks and costs associated with increased and new regulation of corporate governance and disclosure standards; and risks involving environmental or other governmental regulation. Information concerning additional factors that could cause results to differ materially from those projected in the forward-looking statements is contained in ON’s Annual Report on Form 10-K, Quarterly Reports on Form 10-Q, Current Reports on Form 8-K and other of our filings with the Securities and Exchange Commission. These forward-looking statements are as of the date hereof and should not be relied upon as representing our views as of any subsequent date and we do not undertake any obligation to update forward-looking statements to reflect events or circumstances after the date they were made.

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