2014年7月31日 – 富士通半导体株式会社(Fujitsu Semiconductor Limted)与安森美半导体(ON Semiconductor，美国纳斯达克上市代号：ONNN)今天(7月31日)宣布，双方已经达成晶圆代工服务协议。根据此协议的条款，富士通将在其日本福岛县会津若松市的8英寸(200 mm)前工序半导体晶圆制造厂为安森美半导体制造晶圆。晶圆初始生产预计将在从今天起的一年之内开始，安森美半导体未来将有机会从这会津若松市晶圆厂获得更多的产能。
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