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Good morning.
I have looked through the data sheet and the Reference Manual, SOLDERRM/D, but cannot find information about component terminal finish. Therefore please could you let me know what is the terminal finish for Diode BZX84CxxxLT1G. If it is Matte Tin, is it annealled at 150C. Is there a Nickle under plate etc?
Is there a web link that will fully identify terminal finish for all of your components?
Regards
John
Material content details are visible via material composition link at:
http://www.onsemi.com/PowerSolutions/MaterialComposition.do?searchParts=BZX84C10L
In this case for the diode BZX84CxxxLT1G finish plating is 100% matte tin.
Changing the lead plating material to 100% matte Sn (tin) from SnPb raises industry concerns about tin whisker growth. ON Semiconductor has implemented the following mitigation strategies to minimize the occurrence of tin whiskers.
• Increased the plating thickness from 5 µ m to 7.5 µ m minimum; 10 um nominal.
• Implemented a post - plate anneal of 150 ° C for 1 hour within 24 hours of plating
• Implemented strict plating process controls
For more details please see tin whiskers strategies at: http://www.onsemi.com/PowerSolutions/content.do?id=17097
Answered by: ON Semiconductor
2013-02-01 09:33:45.073