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MURA210T3G diode. Does the anode pad or cathode pad get hottest and require more heatsinking?
This device is a clip bond part. The cathode of the die is soldered to the leadframe flag which extends out to the cathode lead. The anode of the die has a copper clip soldered to it which extends out to the anode lead. The cathode has a larger contact area but heat generated in the junction of the device must pass through bulk silicon to exit via the cathode. It does not have to do so to exit via the anode since the PN junction is microns below the anode surface. This means the thermal resistance junction to cathode and junction to anode are very similar. Based on experimental data, heat transfer is a little more effective via the cathode lead, but not by much.
Answered by: ON Semiconductor
2014-06-03 15:10:34.763