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I am using some chips (MC100EP016A, MC100EP446) that have a note in the spec sheet "Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm." I notice that the chips do get hot when turned on and perform erratically unless I blow air at them, but the current fan system I am not using is not portable enough for my final application. Are there any suggested heat sinks or solutions to establish the required transverse airflow / thermal cooling? For both chips, I am using the LQFP-32 package. Thanks!

Devices do not require heatsinks to operate correctly and properly, but can benefit from extended operational lifetimes if heatsinks are used. Reliable Operating device lifetime depends on junction temperature ,refer to our AND8072 and a good heatsink might lower junction temperature as much as 20 Deg C.
Air flow also affects junction temperature (and operational lifetime)
A possible supplier for a heatsink could be:
http://www.coolinnovations.com/products/heatSinksFor_UltraCool3.asp Select heatsinks according to available device top surface dimensions and available application design clearances (surface to cabinet, shroud, adjacent board, etc.)
Answered by:
ON Semiconductor
2014-08-05 09:52:34.159