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what thermal pad size is needed for NTF3055L175 ?

Theta JA is system level dependent, it is not very reliable to use as a system level estimate. Unless the mounting condition used to estimate Theta JA resembles the board design of the application, using a reference temperature parameter on the package to estimate the junction temperature is the most reliable way to for temperature reliability assessment. Other components generating heat can further spoil any attempt to use a Theta JA value from a data sheet due to thermal interactions. Theta JA is primarily used for comparison of package thermal performance on various data sheets, providing that the board design is similar enough. We have provided some estimates of Theta JA for reference, but we still endorse using case temperature estimates to approximate the application performance on any particular devices. Our best estimates for SOT223 package: Psi J-L ~ 9-14 C/W Theta JA (645 sqmm,1oz) ~68 C/W Answered by:
ON Semiconductor
2014-02-03 16:16:51.678