Material Composition

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4  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Au   TOTAL 
Epoxy resin
[%]
Phenolic Resin
[%]
Ortho Cresol Novolac Resin
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Weight
[mg]
Silver (Ag)
[%]
Zinc (Zn)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Phosphorus (P)
[%]
Weight
[mg]
Epoxy resin
[%]
Ethylene dimethacrylate
[%]
Silver (Ag)
[%]
Formaldehyde Polymer
[%]
Weight
[mg]
Tin (Sn)
[%]
Palladium (Pd)
[%]
Nickel (Ni)
[%]
Gold (Au)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Weight
[mg]
proprietary data proprietary data 29690-82-2 1333-86-4 60676-86-0 n/a 7440-22-4 7440-66-6 7439-89-6 7440-50-8 7723-14-0 n/a proprietary data 97-90-5 7440-22-4 9003-36-5 n/a 7440-31-5 7440-05-3 7440-02-0 7440-57-5 n/a 7440-21-3 n/a 7440-57-5 n/a n/a
TLV274 NCV274DR2G Active  Y   Download xls Download xml Download xml Download xml  5.00   2.00   2.50   0.50   90.00   81.9740   0.02   0.13   2.35   97.42   0.08   68.7100   10.00   5.00   80.00   5.00   0.3670   100.00            0.9440   100.00   3.6300   100.00   0.3000   155.9250 
TLV274 NCV274DTBR2G Active  Y           No data available
TLV274 TLV274DR2G Active  Y           No data available
TLV274 TLV274DTBR2G Active  Y   Download xls Download xml Download xml Download xml  5.00   2.00   2.50   0.50   90.00   20.5100      0.12   2.35   97.50   0.03   22.5400   10.00   5.00   80.00   5.00   0.2800      7.60   91.00   1.40   0.0400   100.00   0.7700   100.00   0.2200   44.3600 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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