Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Die			Wire Bond - Al		Case			Case Lid			DBC			Glue				Heat Sink			NTC								Silicone Gel			Solder Paste				Terminal					TOTAL
				Silicon Carbide [%]	Silicon (Si) [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	Fiber Glass (SiO2) [%]	PBT [%]	Weight [mg]	Fiber Glass (SiO2) [%]	PBT [%]	Weight [mg]	Aluminum Trioxide (Al2O3) [%]	Copper (Cu) [%]	Weight [mg]	2,3-epoxypropyl-trimethoxysilan [%]	Miscellaneous [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Nickel Oxide (NiO) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Cobalt Oxide (Co3O4) [%]	Manganese Tetraoxide (Mn3O4) [%]	Weight [mg]	Silica, [(ethenyldimethylsilyl)oxy]- and [(trimethylsilyl)oxy]- modified [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Silicon (Si) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Weight [mg]
				409-21-2	7440-21-3	n/a	7429-90-5	n/a	65997-17-3	26062-94-2	n/a	65997-17-3	26062-94-2	n/a	1344-28-1	7440-50-8	n/a	2530-83-8	trade secret	14808-60-7	n/a	7440-02-0	7440-50-8	n/a	7440-22-4	7440-31-5	1313-99-1	7440-05-3	7440-02-0	1308-06-1	1317-35-7	n/a	68988-89-6	14808-60-7	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-21-3	7440-02-0	7440-50-8	7723-14-0	n/a	n/a
NXH400N100H4Q2F2	NXH400N100H4Q2F2PG	Active	Y	No data available
NXH400N100H4Q2F2	NXH400N100H4Q2F2SG	Active	Y	100	100	124.36940000000001	100	510	35	65	10330	35	65	6410	40	60	17370	10	10	80	410	1.55	98.45	123450	0.9792	0.1998	39.1687	0.9992	0.0999	3.9968	54.5564	10	30	70	8400	6.5	96.5	0.5	5290.0	0.27	1.35	98.355	0.025	4130	176434.3694

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.