Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	Die Attach Solder						Plating		Die			Wire Bond - Al			Case			DBC			Glue				Pressfit Terminal					Silicone Gel			Thermistor																									TOTAL
			Dimethyl phthalate [%]	Amines [%]	Isotridecan-1-ol [%]	Silver (Ag) [%]	Tin (Sn) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon Carbide [%]	Silicon (Si) [%]	Weight [mg]	Nickel (Ni) [%]	Aluminum (Al) [%]	Weight [mg]	Fiber Glass (SiO2) [%]	PBT [%]	Weight [mg]	Aluminum Trioxide (Al2O3) [%]	Copper (Cu) [%]	Weight [mg]	2,3-epoxypropyl-trimethoxysilan [%]	Miscellaneous [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Silicon (Si) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silica, [(ethenyldimethylsilyl)oxy]- and [(trimethylsilyl)oxy]- modified [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Copper chromite black spinel [%]	Titanium Dioxide (TiO2) [%]	Silver (Ag) [%]	Boron Trioxide (B2O3) [%]	Tin (Sn) [%]	Nickel Oxide (NiO) [%]	Lead Oxide (PbO) [%]	Zinc Monoxide (ZnO) [%]	Silica Amorphous (SiO2) [%]	Antimony Trioxide (Sb2O3) [%]	Misc. [%]	Palladium (Pd) [%]	Barium Monoxide (BaO) [%]	Aluminum Trioxide (Al2O3) [%]	Ruthenium Oxide (RuO2) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Iron (Fe) [%]	Lead Oxide (PbO) [%]	Cobalt Oxide (Co3O4) [%]	Manganese Tetraoxide (Mn3O4) [%]	Potassium Monoxide (K2O) [%]	Copper (Cu) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Weight [mg]
			131-11-3	61788-95-2	27458-92-0	7440-22-4	7440-31-5	n/a	7440-31-5	n/a	409-21-2	7440-21-3	n/a	7440-02-0	7429-90-5	n/a	65997-17-3	26062-94-2	n/a	1344-28-1	7440-50-8	n/a	2530-83-8	trade secret	14808-60-7	n/a	7440-21-3	7440-02-0	7440-50-8	7723-14-0	n/a	68988-89-6	14808-60-7	n/a	68186-91-4	13463-67-7	7440-22-4	1303-86-2	7440-31-5	1313-99-1	1317-36-8	1314-13-2	7631-86-9	1309-64-4	proprietary data	7440-05-3	1304-28-5	1344-28-1	12036-10-1	7440-02-0	7440-57-5	7439-89-6	1317-36-8	1308-06-1	1317-35-7	12136-45-7	7440-50-8	14808-60-7	n/a	n/a
NXH240B120H3Q1P1G	NXH240B120H3Q1P1G	Active	1	1	1	4	93	500	100	15.5	100	100	133.2	0.005	99.995	94.5	35	65	17500	33.59	66.41	13654	10	10	80	3600	0.25	0.18	99.54	0.03	122.8	30	70	5740	0.4	0.18	1.67	0.38	2.3		2.61	0.05	0.8		1.98	0.09	0.04	84.53	0.03	2.82				0.09	0.19			1.84	4.819	41364.819
NXH240B120H3Q1	NXH240B120H3Q1PG	Active	1	1	1	4	93	500	100	15.5	100	100	133.2	0.005	99.995	94.5	35	65	17500	33.59	66.41	13654	10	10	80	3600	0.25	0.18	99.54	0.03	122.8	30	70	5740					1.25	0.15				0.16						23.35	0.02	25	22.92	0.15	0.15	1.94	11.05	13.86	38.5	41398.5
NXH240B120H3Q1P1G	NXH240B120H3Q1S1G	Active	No data available
NXH240B120H3Q1	NXH240B120H3Q1SG	Obsolete	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.