Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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3 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Die			Wire Bond - Al		Case			Case Lid			DBC				Glue				Heat Sink			NTC								Silicone Gel			Solder Paste				Terminal					TOTAL
				Silicon Carbide [%]	Silicon (Si) [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	Fiber Glass (SiO2) [%]	PBT [%]	Weight [mg]	Fiber Glass (SiO2) [%]	PBT [%]	Weight [mg]	Aluminum Trioxide (Al2O3) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	2,3-epoxypropyl-trimethoxysilan [%]	Miscellaneous [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Nickel Oxide (NiO) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Cobalt Oxide (Co3O4) [%]	Manganese Tetraoxide (Mn3O4) [%]	Weight [mg]	Silica, [(ethenyldimethylsilyl)oxy]- and [(trimethylsilyl)oxy]- modified [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Silicon (Si) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Weight [mg]
				409-21-2	7440-21-3	n/a	7429-90-5	n/a	65997-17-3	26062-94-2	n/a	65997-17-3	26062-94-2	n/a	1344-28-1	7440-02-0	7440-50-8	n/a	2530-83-8	trade secret	14808-60-7	n/a	7440-02-0	7440-50-8	n/a	7440-22-4	7440-31-5	1313-99-1	7440-05-3	7440-02-0	1308-06-1	1317-35-7	n/a	68988-89-6	14808-60-7	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-21-3	7440-02-0	7440-50-8	7723-14-0	n/a	n/a
NXH200T120H3Q2	NXH200T120H3Q2F2SG	Active	Y	100.00	100.00	219.1050	100.00	39.0000	35.00	65.00	10,330.0000	35.00	65.00	6,690.0000	40.00		60.00	17,490.0000	10.00	10.00	80.00	410.0000	1.55	98.45	123,450.0000	0.98	0.20	39.17	1.00	0.10	4.00	54.56	10.0000	30.00	70.00	8,400.0000	6.50	96.50	0.50	5,040.0000	0.27	1.35	98.36	0.03	3,540.0000	175,618.1050
NXH200T120H3Q2	NXH200T120H3Q2F2STG	Active	Y		100.00	219.1050	100.00	39.0000	35.00	65.00	10,330.0000	35.00	65.00	6,690.0000	40.00		60.00	17,490.0000	10.00	10.00	80.00	410.0000	1.55	98.45	123,450.0000	0.98	0.20	39.17	1.00	0.10	4.00	54.56	10.0000	30.00	70.00	8,400.0000	6.50	96.50	0.50	5,040.0000	0.27	1.35	98.36	0.03	3,540.0000	175,618.1050
NXH200T120H3Q2F2STNG	NXH200T120H3Q2F2STNG	Active	Y		100.00	219.1050	100.00	39.0000	35.00	65.00	10,330.0000	35.00	65.00	6,690.0000	41.70	0.20	58.10	17,490.0000	10.00	10.00	80.00	410.0000	1.55	98.45	123,450.0000	0.98	0.20	39.17	1.00	0.10	4.00	54.56	10.0000	30.00	70.00	8,400.0000	6.50	96.50	0.50	5,040.0000	0.27	1.35	98.36	0.03	3,540.0000	175,618.1050

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.