Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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1 Non-hybrid devices found

Non-hybrid devices

Base part	Part	Status	HF	Die Attach Solder						Plating			Die		Wire Bond - Al		Case						Cover						DBC									Glue				Screw							Silicone Gel				Solder preform					Terminal					Terminal Holder			Thermistor													TOTAL
				Dimethyl phthalate [%]	Amines [%]	Isotridecan-1-ol [%]	Silver (Ag) [%]	Tin (Sn) [%]	Weight [mg]	Tin (Sn) [%]	Nickel (Ni) [%]	Weight [mg]	Silicon Carbide [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	Fiber Glass (SiO2) [%]	Poly(ButyleneTerephthalate) [%]	Antimony Trioxide (Sb2O3) [%]	PBT [%]	Carbonic Dichloride [%]	Weight [mg]	Fiber Glass (SiO2) [%]	Poly(ButyleneTerephthalate) [%]	Antimony Trioxide (Sb2O3) [%]	PBT [%]	Carbonic Dichloride [%]	Weight [mg]	Yitrium Oxide [%]	Silicon Nitride SiN [%]	Indium (In) [%]	Titanium (Ti) [%]	Silver (Ag) [%]	Magnesium Monoxide (MgO) [%]	Misc. [%]	Copper (Cu) [%]	Weight [mg]	2,3-epoxypropyl-trimethoxysilan [%]	Miscellaneous [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Sulfur (S) [%]	Carbon (C) [%]	Manganese (Mn) [%]	Silicon (Si) [%]	Iron (Fe) [%]	Phosphorus (P) [%]	Weight [mg]	Silicone [%]	Hexamethyldisilazane [%]	Dimethyl Siloxane [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Antimony (Sb) [%]	Copper (Cu) [%]	Weight [mg]	Silicon (Si) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Copper (Cu) [%]	Weight [mg]	Tin (Sn) [%]	Nickel Oxide (NiO) [%]	Antimony Trioxide (Sb2O3) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Iron (Fe) [%]	Lead Oxide (PbO) [%]	Cobalt Oxide (Co3O4) [%]	Manganese Tetraoxide (Mn3O4) [%]	Potassium Monoxide (K2O) [%]	Copper (Cu) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Weight [mg]
				131-11-3	61788-95-2	27458-92-0	7440-22-4	7440-31-5	n/a	7440-31-5	7440-02-0	n/a	409-21-2	n/a	7429-90-5	n/a	65997-17-3	30965-26-5	1309-64-4	26062-94-2	94334-64-2	n/a	65997-17-3	30965-26-5	1309-64-4	26062-94-2	94334-64-2	n/a	1314-36-9	12033-60-2	7440-74-6	7440-32-6	7440-22-4	1309-48-4	proprietary data	7440-50-8	n/a	2530-83-8	trade secret	14808-60-7	n/a	7704-34-9	7440-44-0	7439-96-5	7440-21-3	7439-89-6	7723-14-0	n/a	70900-21-9	68909-20-6	68083-19-2	n/a	7440-22-4	7440-31-5	7440-36-0	7440-50-8	n/a	7440-21-3	7440-02-0	7440-50-8	7723-14-0	n/a	7440-22-4	7440-50-8	n/a	7440-31-5	1313-99-1	1309-64-4	7440-02-0	7440-57-5	7439-89-6	1317-36-8	1308-06-1	1317-35-7	12136-45-7	7440-50-8	14808-60-7	n/a	n/a
NVXR22S90M2SPB	NVXR22S90M2SPB	Active	Y	1	1	1	4	93	3000	50	50	80	100	654.851	100	1.315	30	28	3.5	28	10.5	83300	30	28	3.5	28	10.5	27000	0.33	16	0.08	0.16	2.32	0.5	0.03	80.58	47100	10	10	80	600	0.04	0.5	0.9	0.5	98.02	0.04	3000	9.5	0.5	90	32000	3.2	90.6	5.5	0.7	17000	0.27	1.35	98.355	0.025	3000	0.03	99.97	486000	1.25	0.15	0.16	23.35	0.02	25	22.92	0.15	0.15	1.94	11.05	13.86	120	702856.166

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.