Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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1 Non-hybrid devices found

Non-hybrid devices

Base part	Part	Status	HF	Mold Compound-Black								Lead Frame					Die		DBC-1			DBC-2			Die Front-side Attach			Heat Sink			Lead Frame to DBC Attach				Spacer-1					Spacer-2					Spacer to DBC Attach				Spacer to DBC Attach-2			TOTAL
				Epoxy resin [%]	Phenol Resin [%]	Miscellaneous [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Aluminum Hydroxide (Al(OH)3) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Zirconium Dioxide (ZrO2) [%]	Copper (Cu) [%]	Weight [mg]	Zirconium Dioxide (ZrO2) [%]	Copper (Cu) [%]	Weight [mg]	Tin (Sn) [%]	Antimony (Sb) [%]	Weight [mg]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Molybdenum (Mo) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Tin (Sn) [%]	Antimony (Sb) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	trade secret	7631-86-9	1333-86-4	21645-51-2	60676-86-0	n/a	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	7440-21-3	n/a	1314-23-4	7440-50-8	n/a	1314-23-4	7440-50-8	n/a	7440-31-5	7440-36-0	n/a	7440-02-0	7440-50-8	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-22-4	7439-98-7	7440-02-0	7440-50-8	n/a	7440-22-4	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-31-5	7440-36-0	n/a	n/a
NVG800A75L4DSB2	NVG800A75L4DSB2	Active	Y	10	2.5	3	7.5	0.5	14.5	62	14085.52	0.001	0.1	99.879	0.02	11167.7	100	19950.5	40	60	13368.5	40	60	10453	95	5	1321.52	1.55	98.45	200.49	3	96.5	0.5	220	0.13	69.8	0.07	30	397	0.13	0.1	99.74	0.03	397	3	96.5	0.5	1951.58	95	5	54.2	73567.01

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.