Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Download:

Excel

Use~for the exact search match (i.e. ~NTS2101PT1).

5 Non-hybrid devices found

Non-hybrid devices

Page size:

1 - 5 of 5

Base part	Part	Status	HF	Mold Compound-Black										Lead Frame									Die Attach			Plating		Die		Wire Bond - Cu		TOTAL
				Boron zinc hydroxide oxide [%]	Zinc Monoxide (ZnO) [%]	2,4,6-triamino-1,3,5-triazine isocyanuric acid [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	EpoxyNovolaCresins (Cresolic) [%]	Ortho-Cresol Novolac Resin [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Magnesium (Mg) [%]	Silicon (Si) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Epoxy resins [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				138265-88-0	1314-13-2	37640-57-6	7631-86-9	1333-86-4	60676-86-0	64425-89-4	29690-82-2	9003-35-4	n/a	7440-22-4	7439-95-4	7440-21-3	7440-05-3	7440-02-0	7440-57-5	7439-89-6	7440-50-8	n/a	7440-22-4	129915-35-1	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-50-8	n/a	n/a
NSR0170	NSR0170HT1G	Active	Y	3.00	0.50	3.00	80.00	1.00			8.00	4.50	3.0200					36.30		50.20	13.50	0.8600				100.00	0.1300	100.00	0.4900	100.00	0.0100	4.5100
NSR0170	NSR0170P2T5G	Active	Y	3.00	0.50	3.00	80.00	1.00			8.00	4.50	0.1900	17.80				30.90		42.70	8.60	0.2100				100.00	0.0100	100.00	0.0300	100.00	0.0030	0.4430
NSR0170	NSVR0170HT1G	Active	Y	3.00	0.50	3.00	80.00	1.00			8.00	4.50	3.0200					36.30		50.20	13.50	0.8600				100.00	0.1300	100.00	0.4900	100.00	0.0100	4.5100
NSR0170	NSVR0170MX2WT5G	Active	Y				7.50	0.50	79.50	5.00		7.50	0.3400		0.18	0.74	0.10	3.24	0.01		95.72	0.4580	85.00	15.00	0.0080	100.00	0.0530	100.00	0.0150	100.00	0.0050	0.8790
NSR0170	NSVR0170P2T5G	Active	Y	3.00	0.50	3.00	80.00	1.00			8.00	4.50	0.1900	17.80				30.90		42.70	8.60	0.2100				100.00	0.0100	100.00	0.0300	100.00	0.0030	0.4430

Page size:

1 - 5 of 5

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.

Supercharge your onsemi experience by creating an onsemi account

Material Composition

Non-hybrid devices