Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Au   TOTAL 
Epoxy resin
[%]
Boron zinc hydroxide oxide
[%]
Phenolic Resin
[%]
Zinc Monoxide (ZnO)
[%]
2,4,6-triamino-1,3,5-triazine isocyanuric acid
[%]
Silica Amorphous (SiO2)
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Ortho Cresol Novolac Resin
[%]
Phenolic Resin (Novolac)
[%]
Weight
[mg]
Silver (Ag)
[%]
Nickel (Ni)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Weight
[mg]
Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol
[%]
Aluminum Trioxide (Al2O3)
[%]
Weight
[mg]
Tin (Sn)
[%]
Palladium (Pd)
[%]
Nickel (Ni)
[%]
Gold (Au)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Weight
[mg]
proprietary data 138265-88-0 proprietary data 1314-13-2 37640-57-6 7631-86-9 1333-86-4 60676-86-0 29690-82-2 9003-35-4 n/a 7440-22-4 7440-02-0 7439-89-6 7440-50-8 n/a 129915-35-1 1344-28-1 n/a 7440-31-5 7440-05-3 7440-02-0 7440-57-5 n/a 7440-21-3 n/a 7440-57-5 n/a n/a
NLSX4401DFT2G NLSX4401DFT2G Active  Y   Download xls Download xml Download xml Download xml     3.00      0.50   3.00   80.00   1.00      8.00   4.50   4.5000      38.30   52.90   8.80   2.0400            100.00            0.0500   100.00   0.1300   100.00   0.0200   6.7400 
NLSX4401 NLSX4401MU1TCG Active  Y   Download xls Download xml Download xml Download xml  7.00      7.00         15.00   0.50   70.50         12.0800   27.90      1.10   71.00   6.9700   32.00   68.00   0.4500      3.20   95.70   1.10   0.7100   100.00   0.2000   100.00   1.6700   22.0800 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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