Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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10 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black							Lead Frame											Die Attach						Plating					Die		Wire Bond - Cu		TOTAL
				Epoxy resin [%]	Phenol Resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Magnesium (Mg) [%]	Tin (Sn) [%]	Zinc (Zn) [%]	Chromium (Cr) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Epoxy resins [%]	Formaldehyde Polymer [%]	Ortho-Cresol Novolac Resin [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	proprietary data	29690-82-2	1333-86-4	60676-86-0	n/a	7440-22-4	7439-95-4	7440-31-5	7440-66-6	7440-47-3	7440-21-3	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	7440-22-4	129915-35-1	9003-36-5	29690-82-2	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-50-8	n/a	n/a
NCP81071	NCP81071ADR2G	Active	Y	5.00		5.00	2.00	0.50	87.50	28.5800	0.60			0.12				2.35	96.90	0.03	37.6100	10.00	80.00		10.00		2.4000	100.00				1.8900	100.00	1.3300	100.00	0.1800	71.9900
NCP81071	NCP81071AMNTXG	Active	Y	4.70	4.70			0.10	90.50	11.1700	1.00		0.25	0.22	0.25				98.28		7.1100		75.00	25.00			0.1700	100.00				0.3600	100.00	0.7300	100.00	0.0500	19.5900
NCP81071	NCP81071AZR2G	Active	Y	5.00		5.00	2.00	0.50	87.50	13.1300		0.15				0.65	3.00		96.20		8.0400		75.00	25.00			0.1800		6.22	92.71	1.07	0.1500	100.00	1.0100	100.00	0.0800	22.5900
NCP81071	NCP81071BDR2G	Active	Y	5.00		5.00	2.00	0.50	87.50	28.5800	0.60			0.12				2.35	96.90	0.03	37.6100		75.00	25.00			2.4000	100.00				1.8900	100.00	1.3300	100.00	0.1800	71.9900
NCP81071	NCP81071BMNTXG	Active	Y	4.70	4.70			0.10	90.50	11.1700	1.00		0.25	0.22	0.25				98.28		7.1100		75.00	25.00			0.1700	100.00				0.3600	100.00	0.7300	100.00	0.0500	19.5900
NCP81071	NCP81071BZR2G	Active	Y	5.00		5.00	2.00	0.50	87.50	13.1300		0.15				0.65	3.00		96.20		8.0400		80.00			20.00	0.1800		6.22	92.71	1.07	0.1500	100.00	1.0100	100.00	0.0800	22.5900
NCP81071	NCP81071CDR2G	Active	Y	5.00		5.00	2.00	0.50	87.50	28.5800	0.60			0.12				2.35	96.90	0.03	37.6100		75.00	25.00			2.4000	100.00				1.8900	100.00	1.3300	100.00	0.1800	71.9900
NCP81071	NCP81071CMNTXG	Last Shipments	Y	4.70	4.70			0.10	90.50	11.1700	1.00		0.25	0.22	0.25				98.28		7.1100		75.00	25.00			0.1700	100.00				0.3600	100.00	0.7300	100.00	0.0500	19.5900
NCP81071	NCP81071CZR2G	Active	Y	5.00		2.00	2.50	0.50	90.00	13.1300		0.15				0.65	3.00		96.20		8.0400		80.00			20.00	0.0000		6.22	92.71	1.07	0.1500	100.00	1.0100	100.00	0.0800	22.4100
	NCP81071DMR2G	Obsolete	Y	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.