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Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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Use~for the exact search match (i.e. ~NTS2101PT1).

5  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond   Wire Bond - Au   TOTAL 
Epoxy resin
[%]
Silica Amorphous (SiO2)
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Phenolic Resin (Novolac)
[%]
Weight
[mg]
Silver (Ag)
[%]
Zinc (Zn)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Weight
[mg]
Epoxy resin
[%]
Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol
[%]
Silver (Ag)
[%]
Weight
[mg]
Tin (Sn)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Palladium (Pd)
[%]
Copper (Cu)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Weight
[mg]
proprietary data 7631-86-9 1333-86-4 60676-86-0 9003-35-4 n/a 7440-22-4 7440-66-6 7439-89-6 7440-50-8 n/a proprietary data 129915-35-1 7440-22-4 n/a 7440-31-5 n/a 7440-21-3 n/a 7440-05-3 7440-50-8 n/a 7440-57-5 n/a n/a
  NCP61510091MNR2G Active  Y   Download xls Download xml Download xml Download xml  4.70   10.00   0.10   80.50   4.70   48.1700   0.80   0.10   2.60   96.50   52.8000      23.00   77.00   0.9000   100.00   2.6300   100.00   3.4200            100.00   1.5300   109.4500 
NCP6151 NCP6151AD52MNR2G Active  Y   Download xls Download xml Download xml Download xml  4.70   10.00   0.10   80.50   4.70   48.1700   0.80   0.10   2.60   96.50   52.8000      23.00   77.00   0.9000   100.00   2.6300   100.00   3.4200            100.00   1.5300   109.4500 
NCP6151 NCP6151D52MNR2G Active  Y   Download xls Download xml Download xml Download xml  4.70   10.00   0.10   80.50   4.70   48.1700   0.80   0.10   2.60   96.50   52.8000      23.00   77.00   0.9000   100.00   2.6300   100.00   3.4200            100.00   1.5300   109.4500 
NCP6151 NCP6151NS52MNR2G Obsolete  Y           No data available
NCP6151 NCP6151S52MNR2G Active  Y   Download xls Download xml Download xml Download xml  5.00      0.50   89.50   5.00   48.1700   0.80   0.10   2.60   96.50   52.8000   23.00      77.00   0.9000   100.00   2.6300   100.00   4.9400   1.00   99.00   0.1400         109.5800 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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