Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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14 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black									Lead Frame					Die Attach											Plating					Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Fatty acids, C18-unsatd., dimers, polymers with epichlorhydrin [%]	2,2'-[[2-(oxiranylmethoxy)-1,3-phenylene]bis(methylene)]bisoxirane [%]	4-Methyl-2-Phenyl-1H-Imidazole [%]	Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol [%]	Silver (Ag) [%]	Epoxy resins [%]	Aluminum Trioxide (Al2O3) [%]	Antimony Pentoxide (Sb2O5) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	7631-86-9	1333-86-4	60676-86-0	9003-35-4	14808-60-7	n/a	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	68475-94-5	13561-08-5	827-43-0	129915-35-1	7440-22-4	129915-35-1	1344-28-1	1314-60-9	9003-35-4	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
NCP5623B	NCP5623BMUTBG	Last Shipments	Y	6	6			0.5	85		2.5	4.92											85	15				0.05		7.6	91	1.4	0.32	100	0.05	100	0.09	5.43
NCP5623C	NCP5623CMUTBG	Last Shipments	Y	6	6			0.5	85		2.5	4.92											85	15				0.05		7.6	91	1.4	0.32	100	0.05	100	0.09	5.43
NCP5623D	NCP5623DTBR2G	Lifetime	Y	5	5	2		0.5	87.5			19		1.9	98.1		22.54						75	25				1.44		7.6	91	1.4	0.04	100	2	100	0.22	45.24
NCP562	NCP562SQ15T1G	Last Shipments	Y	4.7			10	0.1	80.5	4.7		4.49	0.1	2.3	97.5	0.1	1.31					32			66.8	1.2		0.08	100				1.19	100	0.13	100	0.02	7.22
NCP562	NCP562SQ18T1G	Active	Y	4.7			10	0.1	80.5	4.7		4.49	0.1	2.3	97.5	0.1	1.31					32			66.8	1.2		0.08	100				1.19	100	0.13	100	0.02	7.22
NCP562	NCP562SQ21T1G	Last Shipments	Y	4.7			10	0.1	80.5	4.7		4.49	0.1	2.3	97.5	0.1	1.31					32			66.8	1.2		0.08	100				1.19	100	0.13	100	0.02	7.22
NCP562	NCP562SQ25T1G	Last Shipments	Y	4.7			10	0.1	80.5	4.7		4.49	0.1	2.3	97.5	0.1	1.31					32			66.8	1.2		0.08	100				1.19	100	0.13	100	0.02	7.22
NCP562	NCP562SQ27T1G	Last Shipments	Y	4.7			10	0.1	80.5	4.7		4.49	0.1	2.3	97.5	0.1	1.31					32			66.8	1.2		0.08	100				1.19	100	0.13	100	0.02	7.22
NCP562	NCP562SQ28T1G	Last Shipments	Y	4.7			10	0.1	80.5	4.7		4.49	0.1	2.3	97.5	0.1	1.31					32			66.8	1.2		0.08	100				1.19	100	0.13	100	0.02	7.22
NCP562	NCP562SQ30T1G	Last Shipments	Y	4.7			10	0.1	80.5	4.7		4.49	0.1	2.3	97.5	0.1	1.31					32			66.8	1.2		0.08	100				1.19	100	0.13	100	0.02	7.22
NCP562	NCP562SQ33T1G	Last Shipments	Y	4.7			10	0.1	80.5	4.7		4.49	0.1	2.3	97.5	0.1	1.31					32			66.8	1.2		0.08	100				1.19	100	0.13	100	0.02	7.22
NCP562	NCP562SQ35T1G	Last Shipments	Y	4.7			10	0.1	80.5	4.7		4.49	0.1	2.3	97.5	0.1	1.31					32			66.8	1.2		0.08	100				1.19	100	0.13	100	0.02	7.22
NCP562	NCP562SQ50T1G	Last Shipments	Y	4.7			10	0.1	80.5	4.7		4.49	0.1	2.3	97.5	0.1	1.31					32			66.8	1.2		0.08	100				1.19	100	0.13	100	0.02	7.22
NCP562	NCV562SQ33T1G	Active	Y	4.7			10	0.1	80.5	4.7		4.49	0.1	2.3	97.5	0.1	1.31	30	30	30	9						1	0.08	100				1.19	100	0.13	100	0.02	7.22

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.