Material Composition
Locate Pb-free (RoHS) and Halogen-free Material content details.
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Mold Compound-Black
Lead Frame
Die Attach
Plating
Die
Wire Bond - Au
TOTAL
Phenolic Resin
Ortho Cresol Novolac Resin
Epoxy Phenol Resin
Carbon Black (C)
Fused Silica (SiO2)
Weight
Silver (Ag)
Mangnesium (Mg)
Silicon (Si)
Nickel (Ni)
Iron (Fe)
Copper (Cu)
Weight
Epoxized Condensate Of Para-Hydrobenzaldehyde And Alkyl Phenol
Aluminum Trioxide (Al2O3)
Weight
Tin (Sn)
Palladium (Pd)
Nickel (Ni)
Gold (Au)
Weight
Silicon (Si)
Weight
Gold (Au)
Weight
Weight
proprietary data
29690-82-2
proprietary data
1333-86-4
60676-86-0
n/a
7440-22-4
7439-95-4
7440-21-3
7440-02-0
7439-89-6
7440-50-8
n/a
129915-35-1
1344-28-1
n/a
7440-31-5
7440-05-3
7440-02-0
7440-57-5
n/a
7440-21-3
n/a
7440-57-5
n/a
n/a
NCP5080MUTXG
Obsolete
Y
No data available
NCP508MN15TBG
Obsolete
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508MN18TBG
Obsolete
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508MN25TBG
Obsolete
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508MN28TBG
Obsolete
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508MN30TBG
Obsolete
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508MN33TBG
Obsolete
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508
NCP508MT15TBG
Active
Y
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508
NCP508MT18TBG
Active
Y
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508
NCP508MT25TBG
Active
Y
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508
NCP508MT28TBG
Active
Y
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508
NCP508MT30TBG
Active
Y
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508
NCP508MT33TBG
Active
Y
10.50
89.50
2.9800
0.15
0.65
3.00
96.20
2.4100
32.00
68.00
0.1000
6.22
92.71
1.07
0.0700
100.00
0.4000
100.00
0.0900
6.0500
NCP508
NCP508SQ15T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
3.9000
2.00
36.30
50.20
11.50
1.9200
65.00
35.00
0.1200
100.00
0.0500
100.00
0.1900
100.00
0.0200
6.2000
NCP508
NCP508SQ18T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
3.9000
2.00
36.30
50.20
11.50
1.9200
65.00
35.00
0.1200
100.00
0.0500
100.00
0.1900
100.00
0.0200
6.2000
NCP508
NCP508SQ25T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
3.9000
2.00
36.30
50.20
11.50
1.9200
65.00
35.00
0.1200
100.00
0.0500
100.00
0.1900
100.00
0.0200
6.2000
NCP508
NCP508SQ28T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
3.9000
2.00
36.30
50.20
11.50
1.9200
65.00
35.00
0.1200
100.00
0.0500
100.00
0.1900
100.00
0.0200
6.2000
NCP508
NCP508SQ30T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
3.9000
2.00
36.30
50.20
11.50
1.9200
65.00
35.00
0.1200
100.00
0.0500
100.00
0.1900
100.00
0.0200
6.2000
NCP508
NCP508SQ33T1G
Active
Y
5.00
2.00
5.00
0.50
87.50
3.9000
2.00
36.30
50.20
11.50
1.9200
65.00
35.00
0.1200
100.00
0.0500
100.00
0.1900
100.00
0.0200
6.2000
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Materials Disclosure Disclaimer
Note: Even though all
possible efforts have been made to provide you
with the most accurate information, we can not
guarantee to its completeness and accuracy due
to the fact that the data has been compiled
based on the ranges provided and some
information that may not have been provided by
the subcontractors and raw material suppliers to
protect their business proprietary information.
Based on the above
considerations, this information is provided
only as estimates of the average weight of these
parts and the anticipated significant toxic
metals components. These estimates do not
include trace levels of dopants and metal
materials contained within silicon devices in
the finished products.
There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.
For further explanation on
material composition calculations, please view
our
Product Chemical Content Brochure .
