Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Download:

Excel

Use~for the exact search match (i.e. ~NTS2101PT1).

12 Non-hybrid devices found

Non-hybrid devices

Page size:

1 - 12 of 12

Base part	Part	Status	HF	Mold Compound-Black							Lead Frame						Die Attach					Plating		Die		Wire Bond			Wire Bond - Cu		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Epoxy Phenol Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Epoxy resins [%]	Formaldehyde Polymer [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Palladium (Pd) [%]	Copper (Cu) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	proprietary data	1333-86-4	60676-86-0	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	7440-22-4	129915-35-1	9003-36-5	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-05-3	7440-50-8	n/a	7440-50-8	n/a	n/a
NCP1216A	NCP1216AD100R2G	Last Shipments	Y	5	5	2		0.5	87.5	28.58	0.6	0.12	2.35	96.9	0.03	37.61	10	80		10	2.4	100	1.89	100	1.33				100	0.04	71.85
NCP1216A	NCP1216AD133R2G	Obsolete	Y	No data available
NCP1216A	NCP1216AD65R2G	Last Shipments	Y	5	5	2		0.5	87.5	28.58	0.6	0.12	2.35	96.9	0.03	37.61	10	80		10	2.4	100	1.89	100	1.33				100	0.04	71.85
NCP1216A	NCP1216AP100G	Obsolete	Y	No data available
NCP1216A	NCP1216AP133G	Obsolete	Y	No data available
NCP1216A	NCP1216AP65G	Last Shipments	Y				10.5		89.5	317.53	0.7	0.2	2.6	96.5		131.05		75	25		8.92	100	11.9	100	2.19	1	99	0.09			471.68
NCP1216	NCP1216D100R2G	Last Shipments	Y	5	5	2		0.5	87.5	28.58	0.6	0.12	2.35	96.9	0.03	37.61	10	80		10	2.4	100	1.89	100	1.33				100	0.04	71.85
NCP1216	NCP1216D133R2G	Last Shipments	Y	5	5	2		0.5	87.5	28.58	0.6	0.12	2.35	96.9	0.03	37.61	10	80		10	2.4	100	1.89	100	1.33				100	0.04	71.85
NCP1216	NCP1216D65R2G	Last Shipments	Y	5	5	2		0.5	87.5	28.58	0.6	0.12	2.35	96.9	0.03	37.61	10	80		10	2.4	100	1.89	100	1.33				100	0.04	71.85
NCP1216	NCP1216P100G	Obsolete	Y	No data available
NCP1216	NCP1216P133G	Obsolete	Y	No data available
NCP1216	NCP1216P65G	Obsolete	Y	No data available

Page size:

1 - 12 of 12

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.