Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black						Lead Frame					Die Attach				Plating				Die		Wire Bond - Au		Substrate							TOTAL
				Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Magnesium Hydroxide (Mg(OH)2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Ortho Cresol Novolac Resin [%]	Weight [mg]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Bismaleimide [%]	Cyanic acid (1-methylethylidene)di-4,1-phenylene ester homopolymer [%]	Aluminum Trioxide (Al2O3) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				29690-82-2	1333-86-4	60676-86-0	1309-42-8	9003-35-4	n/a	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	54208-63-8	29690-82-2	n/a	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	13676-54-5	25722-66-1	1344-28-1	7440-02-0	7440-57-5	7440-50-8	n/a	n/a
NC7SVU04	NC7SVU04L6X	Last Shipments	Y	14.9946	0.539374	81.9849	2.48112		0.927							33.3333	66.6667	0.015		24	76	0.025	100	0.121	100	0.031	42.7788	31.9927	2.55942	2.55942	0.548446	19.5612	0.547	1.666
NC7SVU04	NC7SVU04P5X	Last Shipments	Y	10.5506	0.548137	85.9009		3.00033	2.4264	0.127443	2.36983	97.4208	0.0819274	3.2956	69	31		0.0202	4.09836	95.082	0.819672	0.0244	100	0.2027	100	0.0304								5.9997

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.