Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Die Attach				Die				Electrode						Glass Lid /Cap						Lid Attach			Solder Ball				Substrate and Solder Mask				TOTAL
				Bisphenol A_Epichlorohydrin Polymer [%]	Epoxy resins [%]	Acrylic resins [%]	Weight [mg]	Misc. [%]	Silicon (Si) [%]	Aluminum (Al) [%]	Weight [mg]	Titanium (Ti) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Copper (Cu) [%]	Aluminum (Al) [%]	Weight [mg]	Boron Trioxide (B2O3) [%]	Silica Amorphous (SiO2) [%]	Barium Monoxide (BaO) [%]	Aluminum Trioxide (Al2O3) [%]	Calcium Monoxide (CaO) [%]	Weight [mg]	Photoinitiator [%]	Epoxy Prepolymer [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Silica crystalline [%]	Cured Resin of Solder Mask [%]	Bismaleimide Triazine resin [%]	Weight [mg]	Weight [mg]
				25068-38-6	129915-35-1	proprietary data	n/a	proprietary data	7440-21-3	7429-90-5	n/a	7440-32-6	7440-02-0	7440-57-5	7440-50-8	7429-90-5	n/a	1303-86-2	7631-86-9	1304-28-5	1344-28-1	1305-78-8	n/a	proprietary data	proprietary data	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	14808-60-7, 14464-46-1	proprietary data	proprietary data	n/a	n/a
MT9V124	MT9V124EBKSTC-CP	Last Shipments	Y	60	20	20	0.16	0.38	98.63	0.99	1.69	0.06	59.54	2.4	1.5	36.5	0.17	14.2	56.8	8	11	10	7.89	25	75	0.003	3	96.5	0.5	0.14	10	47.5	42.5	0.72	10.773
MT9V124	MT9V124EBKSTC-CR	Last Shipments	Y	60	20	20	0.16	0.38	98.63	0.99	1.69	0.06	59.54	2.4	1.5	36.5	0.17	14.2	56.8	8	11	10	7.89	25	75	0.003	3	96.5	0.5	0.14	10	47.5	42.5	0.72	10.773

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.