Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black									Lead Frame						Die Attach					Plating					Die		Wire Bond - Au		Wire Bond - Cu		TOTAL
				Epoxy resin [%]	Phenol Resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Formaldehyde Polymer [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	proprietary data	29690-82-2	7631-86-9	1333-86-4	60676-86-0	9003-35-4	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	7440-22-4	54208-63-8	9003-36-5	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	7440-50-8	n/a	n/a
MM74HCT245	MM74HCT245MTC	Active		5	4			10	1	80		24.35			1.9	98.1		38.58	10	80		10	2.46		7.6	91	1.4	3.44	100	0.29			100	0.16	69.28
MM74HCT245	MM74HCT245MTCX	Active		7.5		2.5		7.5	0.5	82		40.867		0.12	2.35	97.5	0.03	30.624	10	80		10	0.136		2.7	95.5	1.8	0.223	100	1.25			100	0.25	73.35
MM74HCT245	MM74HCT245WM	Active	Y				6		1	90	3	321.6	0.799907	0.149837	2.2802	96.6698	0.10028	171.52		72.5	27.5		0.4286	100				16.08	100	25.835	100	0.536			535.9996
MM74HCT245	MM74HCT245WMX	Active	Y				6		1	90	3	321.6	0.799907	0.149837	2.2802	96.6698	0.10028	171.52		72.5	27.5		0.4286	100				16.08	100	25.835	100	0.536			535.9996

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.