Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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5 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black								Lead Frame									Die Attach				Die Attach Epoxy			Plating		Die		Wire Bond - Au		TOTAL
				Metal Hydroxide [%]	2,6-dibromo-4-[1-(3-bromo-4-hydroxyphenyl)-1-methylethyl]phenol [%]	Ortho Cresol Novolac Resin [%]	Antimony Trioxide (Sb2O3) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Manganese (Mn) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Ortho Cresol Novolac Resin [%]	Weight [mg]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	6386-73-8	29690-82-2	1309-64-4	1333-86-4	60676-86-0	9003-35-4	n/a	7440-22-4	7440-66-6	7439-96-5	7440-21-3	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	54208-63-8	29690-82-2	n/a	7440-22-4	54208-63-8	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
LM431SB	LM431SBCM32X	Active	Y		1.79868	25	1.0066	0.49505	71.6997		6.06	0.4		0.8	0.3	42	56.5			2.371								100	0.206	100	0.048	100	0.02	8.705
LM431SB	LM431SBCM3X	Active	Y	3.5		8		0.5	80	8	6.504	0.03		0.43	0.14	41.7	57.69		0.01	2.1622					92	8	0.009	100	0.159	100	0.29	100	0.039	9.1632
LM431SB	LM431SBCMFX	Active	Y	3.5		8		0.5	80	8	5.51		0.12				2.35	97.5	0.03	4.826					92	8	0.047	100	0.203	100	1.67	100	0.072	12.328
LM431SB	LM431SBCMLX	Last Shipments	Y		2.99816	14.4739	2.50038	0.999387	79.0282		26.116	0.480101					0.101074	99.3893	0.0294799	23.745	76	24		0.089				100	0.472	100	0.469	100	0.025	50.916
LM431SB	LM431SBIMFX	Active	Y			20		0.998185	79.0018		5.51	0.497306					0.0414422	99.4613	0	4.826	74.5		25.5	0.047				100	0.203	100	1.67	100	0.072	12.328

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.