Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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13 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black									Lead Frame						Die Attach										Plating		Die		Wire Bond			Wire Bond - Au		Wire Bond - Cu			TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Epoxy Phenol Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Epoxy resins [%]	Phenolic Resin [%]	Inorganic filler [%]	Dicyandiamine [%]	Polybutadiene polymer [%]	Acrylic resins [%]	Formaldehyde Polymer [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Palladium (Pd) [%]	Copper (Cu) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Palladium (Pd) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	proprietary data	1333-86-4	60676-86-0	29690-82-2	9003-35-4	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	7440-22-4	129915-35-1	proprietary data	proprietary data	461-58-5	proprietary data	proprietary data	9003-36-5	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-05-3	7440-50-8	n/a	7440-57-5	n/a	7440-05-3	7440-50-8	n/a	n/a
LM358	LM358ADR2G	Active	Y					0.50	87.50	6.00	6.00	28.5800	0.60	0.12	2.35	96.90	0.03	37.6100	23.00	77.00								2.4000	100.00	1.8900	100.00	1.3300						1.60	98.40	0.0400	71.8500
LM358A_XFCS	LM358AM	Obsolete		No data available
LM358A_XFCS	LM358AMX	Obsolete		No data available
LM358A_XFCS	LM358AN	Obsolete		No data available
LM358	LM358DG	Obsolete	Y	No data available
LM358	LM358DMR2G	Active	Y	5.00	5.00	2.00		0.50	87.50			14.9600	2.50	0.10	2.40	95.00		14.2600	2.50	84.50		2.50	2.50	0.50			7.50	0.9100	100.00	0.3800	100.00	1.3200	1.00	99.00	0.1000						31.9300
LM358	LM358DR2G	Active	Y					0.50	87.50	6.00	6.00	28.5800	0.60	0.12	2.35	96.90	0.03	37.6100	2.50	80.00					6.50	11.00		2.4000	100.00	1.8900	100.00	1.3300						1.60	98.40	0.1800	71.9900
LM358	LM358EDR2G	Active	Y	5.00	5.00	2.00		0.50	87.50			28.5800	0.60	0.12	2.35	96.90	0.03	37.6100		75.00	25.00							2.4000	100.00	1.8900	100.00	1.3300							100.00	0.1800	71.9900
LM358_XFCS	LM358M	Obsolete		No data available
LM358_XFCS	LM358MX	Obsolete		No data available
LM358_XFCS	LM358N	Obsolete		No data available
LM358	LM358NG	Last Shipments	Y				10.50		89.50			317.5300	0.70	0.20	2.60	96.50		139.7800		75.00	25.00							8.9200	100.00	13.5600	100.00	2.1900				100.00	0.1800				482.1600
LM358S	LM358SNG	Obsolete	Y	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.

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Material Composition

Non-hybrid devices