Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black					Lead Frame					Die Attach				Plating		Die		Wire Bond - Au		PCB						TOTAL
				1,2,3,6-Tetrahydrophthalic acid anhydride [%]	Bisphenol A_Epichlorohydrin Polymer [%]	Ortho Cresol Novolac Resin [%]	2,4,6-Tris[Bis(Methoxymethyl)Amino]-1,3,5-Triazine [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Ortho Cresol Novolac Resin [%]	Ortho-Cresol Novolac Resin [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Bisphenol A_Epichlorohydrin Polymer [%]	Fiber Glass (SiO2) [%]	Gold (Au) [%]	Copper (Cu) [%]	Barium Sulfate (BaSO4) [%]	Weight [mg]	Weight [mg]
				85-43-8	25068-38-6	29690-82-2	3089-11-0	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	n/a	7440-22-4	29690-82-2	29690-82-2	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	25068-38-6	65997-17-3	7440-57-5	7440-50-8	7727-43-7	n/a	n/a
KDT00030	KDT00030ATR	Active	Y	40	60			0.4						87		13	0.05			100	0.35	100	0.01	0.84	74.68	0.21	23.64	0.63	0.474	1.284
KDT00030	KDT00030TR	Active	Y			50	50	25.772	0.0304599	0.131993	2.40126	97.4363	19.698	90	10		0.05	100	1	100	0.05	100	0.01							46.58

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.