Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Download:

Excel

Use~for the exact search match (i.e. ~NTS2101PT1).

2 Non-hybrid devices found

Non-hybrid devices

Page size:

1 - 2 of 2

Base part	Part	Status	HF	Mold Compound-Black								Lead Frame						Die Attach				Die Attach Tape						Plating					Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Magnesium (Mg) [%]	Manganese (Mn) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Phenolic Resin-2 [%]	Ortho Cresol Novolac Resin [%]	2,4,6-Tris[Bis(Methoxymethyl)Amino]-1,3,5-Triazine [%]	Weight [mg]	Silicon Dioxide [%]	Acrylic AE Copolymer [%]	Formaldehyde, polymer with 4,4-(1-methylethylidene)bisphenol [%]	Ortho Cresol Novolac Resin [%]	Formaldehyde Polymer [%]	Weight [mg]	Silver (Ag) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	29690-82-2	1333-86-4	60676-86-0	9003-35-4	14808-60-7	n/a	7439-95-4	7439-96-5	7440-21-3	7440-02-0	7440-50-8	n/a	54208-63-8	29690-82-2	3089-11-0	n/a	7631-86-9	58152-79-7	25085-75-0	29690-82-2	9003-36-5	n/a	7440-22-4	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
FUSB303BTMX	FUSB303BTMX	Active	Y	6	6		0.5	85		2.5	1.638	0.15		0.65	3	96.2	0.793					50	15	14	7	14	0.121	0.529101	1.0582	97.8836	0.529101	0.0378	100	0.281	100	0.0358	2.9066
FUSB303BTMX	FUSB303TMX	Active, Not Rec	Y			6.03301	0.227661	87.934	5.80535		1.757		0.126103	0.75662		99.1173	0.793	14.1176	21.1765	64.7059	0.085							0.529101	1.0582	97.8836	0.529101	0.0378	100	0.198	100	0.0358	2.9066

Page size:

1 - 2 of 2

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.