Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black								Lead Frame					Die Attach				Die Attach2					Die Attach Epoxy					Die Attach Solder				Plating		Die		Wire Bond - Al		Wire Bond - Au		Heat Sink				TOTAL
				2,6-dibromo-4-[1-(3-bromo-4-hydroxyphenyl)-1-methylethyl]phenol [%]	Ortho Cresol Novolac Resin [%]	Antimony Trioxide (Sb2O3) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Poly(oxypropylene)diamine [%]	Miscellaneous [%]	Silver (Ag) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Poly(oxypropylene)diamine [%]	Miscellaneous [%]	Silver (Ag) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Aluminum Nitride (AlN) [%]	Copper (Cu) [%]	Aluminum (Al) [%]	Weight [mg]	Weight [mg]
				6386-73-8	29690-82-2	1309-64-4	1333-86-4	60676-86-0	14464-46-1	9003-35-4	n/a	7440-22-4	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	9046-10-0	trade secret	7440-22-4	9003-35-4	n/a	9046-10-0	trade secret	7440-22-4	9003-35-4	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	7440-31-5	n/a	7440-21-3	n/a	7429-90-5	n/a	7440-57-5	n/a	24304-00-5	7440-50-8	7429-90-5	n/a	n/a
FSBB20CH120D	FSBB20CH120D	Active, Not Rec	Y		6		1		87	6	9345.94	9.9999E-4	0.099999	99.869	0.0299997	3026.94										3	5	85	7	3.1824	3	96.5	0.5	63.1609	100	113.724	100	119.273	100	50.409	100	1.79769	39	61		2416.55	15140.97699
FSBB20CH120DF	FSBB20CH120DF	Active, Not Rec	Y	3	20	2.5	1	73.5			10122	0.0340405	0.119952	99.8059	0.0400613	4318.38	2.5	92.5	5	31.4	3	5	85	7	0.163										100	53.3	100	67.7	100	18.3	100	1.12			100	1880	16492.363

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.