Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	Mold Compound-White					Lead Frame						Die Attach			Plating		Die			Wire Bond - Au		Coupling Gel			TOTAL
			2,6-dibromo-4-[1-(3-bromo-4-hydroxyphenyl)-1-methylethyl]phenol [%]	Ortho Cresol Novolac Resin [%]	Antimony Trioxide (Sb2O3) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Gallium Arsenide (AsGa) [%]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Dimethyl Cyclosiloxanes [%]	Trimethoxy(methyl)silane (C4H12O3Si) [%]	Weight [mg]	Weight [mg]
			6386-73-8	29690-82-2	1309-64-4	60676-86-0	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	54208-63-8	n/a	7440-31-5	n/a	1303-00-0	7440-21-3	n/a	7440-57-5	n/a	69430-24-6	1185-55-3	n/a	n/a
FOD8001	FOD8001	Active	3.99755	23.9649	2.99816	69.0394	98.06	0.250013	0.119939	2.29741	97.3022	0.030407	59.197	80	20	0.754	100	2.1	6.99975	93.0002	4.043	100	0.25	1.0989	98.9011	4.18236	168.58636
FOD8001	FOD8001R2	Active	3.99755	23.9649	2.99816	69.0394	98.06	0.250013	0.119939	2.29741	97.3022	0.030407	59.197	80	20	0.754	100	2.1	6.99975	93.0002	4.043	100	0.25	1.0989	98.9011	4.18236	168.58636

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.