Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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1 Non-hybrid devices found

Non-hybrid devices

Base part	Part	Status	HF	Exempt	Mold Compound-Black					Lead Frame					Die Attach				Die Attach Epoxy					Die Attach Solder				Plating		Die		Wire Bond - Al		Wire Bond - Cu		DBC				TOTAL
					Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Poly(oxypropylene)diamine [%]	Miscellaneous [%]	Silver (Ag) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Lead (Pb) [%]	Tin (Sn) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Aluminum Trioxide (Al2O3) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
					29690-82-2	1333-86-4	60676-86-0	9003-35-4	n/a	7440-22-4	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	9046-10-0	trade secret	7440-22-4	9003-35-4	n/a	7440-22-4	7439-92-1	7440-31-5	n/a	7440-31-5	n/a	7440-21-3	n/a	7429-90-5	n/a	7440-50-8	n/a	1344-28-1	7440-02-0	7440-50-8	n/a	n/a
FNB33060T	FNB33060T	Active	Y	7a	5	1	89	5	9436.02	9.9999E-4	0.099999	99.869	0.0299997	3026.94	3	96.5	0.5	21.549	3	5	85	7	1.34901	2.5	92.5	5	1.07957	100	113.724	100	52.1228	100	50.409	100	0.83371	40	1	59	2416.55	15120.57709

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.