Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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3  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach Solder   Plating   Die   Wire Bond - Al   TOTAL 
Polymer(phenyl glycidil ether)-co-dicyclopentadiene
[%]
Proprietary
[%]
Carbon Black (C)
[%]
Aluminum Hydroxide (Al(OH)3)
[%]
Fused Silica (SiO2)
[%]
Ortho-Cresol Novolac Resin
[%]
Phenolic Resin (Novolac)
[%]
Weight
[mg]
Zinc (Zn)
[%]
Nickel (Ni)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Phosphorus (P)
[%]
Weight
[mg]
Silver (Ag)
[%]
Lead (Pb)
[%]
Tin (Sn)
[%]
Weight
[mg]
Tin (Sn)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Aluminum (Al)
[%]
Weight
[mg]
Weight
[mg]
119345-05-0 proprietary data 1333-86-4 21645-51-2 60676-86-0 29690-82-2 9003-35-4 n/a 7440-66-6 7440-02-0 7439-89-6 7440-50-8 7723-14-0 n/a 7440-22-4 7439-92-1 7440-31-5 n/a 7440-31-5 n/a 7440-21-3 n/a 7429-90-5 n/a n/a
FGH60N60SFDTU FGH60N60SFDTU Last Shipments  Y   7a   Download xls Download xml Download xml Download xml  5.00   5.00   0.50   4.50   75.00   5.00   5.00   1,739.8000   0.05   3.27   0.06   96.60   0.03   3,612.9000   2.50   92.50   5.00   35.0250   100.00   31.0000   100.00   32.0000   100.00   6.0000   5,456.7250 
FGH60N60SF_F085 FGH60N60SFDTU-F085 Obsolete            No data available
FGH60N60SF FGH60N60SFTU Obsolete  Y           No data available
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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