Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black							Lead Frame					Die Attach							Plating				Die		Wire Bond			Wire Bond - Cu		TOTAL
				Ortho Cresol Novolac Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	EpoxyNovolaCresins (Cresolic) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Isobornyl Methacrylate [%]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Isobornyl Acrylate [%]	Misc. [%]	Tricyclo[5.2.1.02,6]decanedimethanol Diacrylate (C18H24O4) [%]	Weight [mg]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Palladium (Pd) [%]	Copper (Cu) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				29690-82-2	7631-86-9	1333-86-4	60676-86-0	64425-89-4	9003-35-4	n/a	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	7534-94-3	7440-22-4	54208-63-8	5888-33-5	proprietary data	42594-17-2	n/a	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-05-3	7440-50-8	n/a	7440-50-8	n/a	n/a
FDMC4435BZ	FDMC4435BZ	Active	Y	19.0352		0.999565	79.9652			11.505	0.13048	2.40084	97.4687		7.664		80	20				0.198	9.09	89.9	1.01	0.198	100	1.05				100	0.461	21.076
FDMC4435BZ	FDMC4435BZ-F126	Last Shipments	Y		7.5	0.5	79.5	5	7.5	10.3333	0.12	2.35	97.5	0.03	13.2	6	81.5		6	0.5	6	0.1359	7.13	91.68	1.19	0.259	100	1.055	1.3	98.7	0.553			25.5362
FDMC4435BZ	FDMC4435BZ-F127	Active	Y	19.0352		0.999565	79.9652			11.505	0.13048	2.40084	97.4687		7.664		80	20				0.198	9.09	89.9	1.01	0.198	100	1.05				100	0.461	21.076
FDMC4435BZ	FDMC4435BZ-F127-L701	Last Shipments	Y	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.