Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black								Lead Frame						Die Attach							Plating					Die		Wire Bond				Wire Bond - Au		TOTAL
				Epoxy resin [%]	4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl [%]	Phenolic Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Ethylene glycol dicyclopentenyl ether methacrylate [%]	Bis(a,a-dimethylbenzyl) Peroxide [%]	Silver (Ag) [%]	Acrylic resins [%]	Aluminum (Al) [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Palladium (Pd) [%]	Gold (Au) [%]	Copper (Cu) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	85954-11-6	proprietary data	1333-86-4	60676-86-0	9003-35-4	14808-60-7	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	68586-19-6	80-43-3	7440-22-4	proprietary data	7429-90-5	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-05-3	7440-57-5	7440-50-8	n/a	7440-57-5	n/a	n/a
FAN3216T	FAN3216TMX	Active	Y		4.5		0.5	92	3		45.29	5	0.12	2.4	92.4	0.08	31.136	13			35	17	35	1.144	100				3.44	100	2.16	3.1	0.35	96.55	0.314			83.484
FAN3216T_F085	FAN3216TMX-F085	Active	Y	6		6	0.5	85		2.5	47.026		0.12	2.35	97.5	0.03	29.8891		3.5	0.65	95.85			0.2109		3.41	95.45	1.14	0.4175	100	1.4418					100	0.23	79.2153

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.