Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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21 Non-hybrid devices found

Non-hybrid devices

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1 - 21 of 21

Base part	Part	Status	HF	Die				Glass Attach Epoxy			Glass Lid /Cap		Insulating Layer					Passivation									RDL				Solder Ball				TOTAL
				Misc. [%]	Silicon (Si) [%]	Aluminum (Al) [%]	Weight [mg]	Imidazole [%]	Epoxy Phenol Novolak Resin [%]	Weight [mg]	Glass [%]	Weight [mg]	9-Phenylacridine [%]	2-Propenoic acid [%]	Other Additive Agents [%]	Butylglycol Acetate [%]	Weight [mg]	Epoxy resin [%]	Coupling Agent [%]	Modified SBR Rubber [%]	Melamine Compound [%]	Trispenol Compound [%]	Photosensitizer [%]	Hydroxystyrene Resin [%]	Ethyl Lactate [%]	Weight [mg]	Nickel (Ni) [%]	Gold (Au) [%]	Copper (Cu) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				proprietary data	7440-21-3	7429-90-5	n/a	288-32-4	28064-14-4	n/a	65977-17-3	n/a	602-56-2	1245638-61-2	proprietary data	112-07-2	n/a	proprietary data	proprietary data	proprietary data	proprietary data	proprietary data	proprietary data	proprietary data	97-64-3	n/a	7440-02-0	7440-57-5	7440-50-8	n/a	7440-22-4	7440-31-5	7440-50-8	n/a	n/a
AR1335	AR1335CSSC11SMD20	Obsolete	Y	No data available
AR1335	AR1335CSSC11SMKA0-CP	Active	Y		100		8.34	25	75	9.0E-4	100	34.79	5	30	60	5	3.53	1.5	2	0.5	3	3	8	22	60	0.78	60	1	39	0.54	6.64	88.92	4.44	1.211	49.1919
AR1335	AR1335CSSC11SMKA0-CP1	Last Shipments	Y		100		8.34	25	75	9.0E-4	100	34.79	5	30	60	5	3.53	1.5	2	0.5	3	3	8	22	60	0.78	60	1	39	0.54	6.64	88.92	4.44	1.211	49.1919
AR1335	AR1335CSSC11SMKA0-CP2	Active	Y		100		8.34	25	75	9.0E-4	100	34.79	5	30	60	5	3.53	1.5	2	0.5	3	3	8	22	60	0.78	60	1	39	0.54	6.64	88.92	4.44	1.211	49.1919
	AR1335CSSC11SMKA0-CR	Obsolete	Y	No data available
	AR1335CSSC11SMKA0-CR1	Last Shipments	Y		100		8.34	25	75	9.0E-4	100	34.79	5	30	60	5	3.53	1.5	2	0.5	3	3	8	22	60	0.78	60	1	39	0.54	6.64	88.92	4.44	1.211	49.1919
	AR1335CSSC32SMD10-E	Obsolete	Y	No data available
AR1335	AR1335CSSC32SMD20	Active	Y	0.38	98.63	0.99	0																												0
	AR1335CSSC32SMFA0-DRIA-E	Obsolete	Y	No data available
AR1335	AR1335CSSM11SMD20	Obsolete	Y	No data available
AR1335	AR1335CSSM11SMKA0-CP	Active	Y		100		8.34	25	75	9.0E-4	100	34.79	5	30	60	5	3.53	1.5	2	0.5	3	3	8	22	60	0.78	60	1	39	0.54	6.64	88.92	4.44	1.211	49.1919
	AR1335CSSM32SMD20	Consult Sales Office	Y	No data available
	AR1335HSSC11SMAA0-DP	Obsolete	Y	No data available
	AR1335HSSC11SMAA0-DPBR	Obsolete	Y	No data available
	AR1335HSSC11SMAA0-DPBR-E	Obsolete	Y	No data available
	AR1335HSSC11SMAA0-DR	Obsolete	Y	No data available
	AR1335HSSC11SMAA0-DR-E	Obsolete	Y	No data available
	AR1335HSSC11SMAA0-DRBR	Obsolete	Y	No data available
	AR1335HSSC11SMAA0-DRBR-E	Obsolete	Y	No data available
	AR1335HSSC32SMAA0-DR-E	Obsolete	Y	No data available
	AR1335HSSC32SMAA0-DRBR-E	Obsolete	Y	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.