Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Die Attach   Die   Wire Bond - Au   Solder Ball   Substrate and Solder Mask   TOTAL 
Phenolic Resin
[%]
Epoxy Phenol Resin
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Weight
[mg]
Epoxy resins
[%]
Fused Silica (SiO2)
[%]
Acrylic resins
[%]
Polyimide
[%]
Modified Silicon Dioxide (SiO2)
[%]
Weight
[mg]
Misc.
[%]
Silicon (Si)
[%]
Aluminum (Al)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Silver (Ag)
[%]
Tin (Sn)
[%]
Copper (Cu)
[%]
Weight
[mg]
Fiber Glass (SiO2)
[%]
Inorganic Filler of Solder Mask_Talc (Mg3Si4O10(OH)2)
[%]
Silica Amorphous (SiO2)
[%]
Acetophenone Derivative
[%]
Carbon Black (C)
[%]
2,4-Diethyl-9H-thioxanthen-9-one (DETX)
[%]
Bismaleimide Triazine resin
[%]
Formaldehyde Polymer
[%]
Copper (Cu)
[%]
Barium Sulfate (BaSO4)
[%]
Weight
[mg]
Weight
[mg]
proprietary data proprietary data 1333-86-4 60676-86-0 n/a 129915-35-1 60676-86-0 proprietary data proprietary data 67762-90-7 n/a proprietary data 7440-21-3 7429-90-5 n/a 7440-57-5 n/a 7440-22-4 7440-31-5 7440-50-8 n/a 65997-17-3 14807-96-6 7631-86-9 proprietary data 1333-86-4 82799-44-8 proprietary data 9003-36-5 7440-50-8 7727-43-7 n/a n/a
AP0100CS AP0100CS2L00SUGA0-DR Active  Y   Download xls Download xml Download xml Download xml  4.75   5.00   0.25   90.00   43.6700   9.50   29.50   14.50   29.50   17.00   0.6600   0.29   99.61   0.10   6.6100   100.00   1.0800   3.00   96.50   0.50   10.4600   21.19   1.31   0.32   1.96   0.33   0.33   13.08   3.92   47.42   10.14   27.3300   89.8100 
AP0100CS AP0100CS2L00SUGA0-DR1 Last Shipments  Y   Download xls Download xml Download xml Download xml  4.75   5.00   0.25   90.00   43.6700   9.50   29.50   14.50   29.50   17.00   0.6600   0.29   99.61   0.10   6.6100   100.00   1.0800   3.00   96.50   0.50   10.4600   21.19   1.31   0.32   1.96   0.33   0.33   13.08   3.92   47.42   10.14   27.3300   89.8100 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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