Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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9 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black								Lead Frame									Die Attach									Die Attach Epoxy					Plating					Die		Wire Bond - Au		TOTAL
				Epoxy resin [%]	Phenol Resin [%]	Phenolic Resin [%]	Ortho Cresol Novolac Resin [%]	Epoxy Phenol Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Magnesium (Mg) [%]	Zinc (Zn) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Ethylene glycol dicyclopentenyl ether methacrylate [%]	Ethylene dimethacrylate [%]	Bis(a,a-dimethylbenzyl) Peroxide [%]	Silver (Ag) [%]	Epoxy resins [%]	Phenolic Resin-2 [%]	Formaldehyde Polymer [%]	Weight [mg]	Poly(oxypropylene)diamine [%]	Miscellaneous [%]	Silver (Ag) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				proprietary data	proprietary data	proprietary data	29690-82-2	proprietary data	1333-86-4	60676-86-0	n/a	7440-22-4	7439-95-4	7440-66-6	7440-21-3	7440-02-0	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	68586-19-6	97-90-5	80-43-3	7440-22-4	129915-35-1	54208-63-8	9003-36-5	n/a	9046-10-0	trade secret	7440-22-4	9003-35-4	n/a	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
74LCX74	74LCX74BQX	Active	Y				10.00		1.00	89.00	10.2000			0.12			2.35	97.49	0.03	6.4610										3.00	5.00	85.00	7.00	0.0590		9.09	89.39	1.52	0.0660	100.00	0.1150	100.00	0.3480	17.2490
74LCX74	74LCX74M	Last Shipments	Y				20.00		1.00	79.00	81.9740	0.02		0.13			2.35	97.42	0.08	68.7100					78.50		21.50		0.3670							3.60	94.39	2.01	0.9440	100.00	3.6300	100.00	0.2800	155.9050
74LCX74	74LCX74MTC	Last Shipments	Y				20.00		1.00	79.00	32.2000		0.15		0.65	3.20		96.00		21.5630					80.00		20.00		0.0550							3.11	95.03	1.86	0.1610	100.00	0.4960	100.00	0.3480	54.8230
74LCX74	74LCX74MTCX	Active	Y	9.50	5.00				0.50	85.00	32.2000		0.15		0.65	3.20		96.00		21.5630		3.50		0.65	95.85				0.0550							3.11	95.03	1.86	0.1610	100.00	0.4960	100.00	0.3480	54.8230
74LCX74	74LCX74MX	Last Shipments	Y				20.00		1.00	79.00	81.9740	0.02		0.13			2.35	97.42	0.08	68.7100					78.50		21.50		0.3670							3.60	94.39	2.01	0.9440	100.00	3.6300	100.00	0.2800	155.9050
MC74LCX74	MC74LCX74DG	Active	Y					10.50		89.50	43.4300	1.10		0.20			2.60	96.10		69.6200					75.00	25.00			4.4400						100.00				3.2700	100.00	0.9800	100.00	0.3100	122.0500
MC74LCX74	MC74LCX74DR2G	Active	Y					10.50		89.50	43.4300	1.10		0.20			2.60	96.10		69.6200					75.00	25.00			4.4400						100.00				3.2700	100.00	0.9800	100.00	0.3100	122.0500
MC74LCX74	MC74LCX74DTG	Active	Y	5.00		5.00	2.00		0.50	87.50	19.0000						1.90	98.10		22.5400					75.00	25.00			1.4400							7.60	91.00	1.40	0.0400	100.00	2.0000	100.00	0.2200	45.2400
MC74LCX74	MC74LCX74DTR2G	Active	Y	5.00		2.00	2.50		0.50	90.00	19.0000						1.90	98.10		22.5400	10.00		5.00		80.00			5.00	1.4400							7.60	91.00	1.40	0.0400	100.00	2.0000	100.00	0.2200	45.2400

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.

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Material Composition

Non-hybrid devices